JPH0471340B2 - - Google Patents

Info

Publication number
JPH0471340B2
JPH0471340B2 JP59222181A JP22218184A JPH0471340B2 JP H0471340 B2 JPH0471340 B2 JP H0471340B2 JP 59222181 A JP59222181 A JP 59222181A JP 22218184 A JP22218184 A JP 22218184A JP H0471340 B2 JPH0471340 B2 JP H0471340B2
Authority
JP
Japan
Prior art keywords
lead
pitch
leads
lead frame
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59222181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61101062A (ja
Inventor
Shinya Funayama
Akira Suzuki
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP22218184A priority Critical patent/JPS61101062A/ja
Publication of JPS61101062A publication Critical patent/JPS61101062A/ja
Publication of JPH0471340B2 publication Critical patent/JPH0471340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP22218184A 1984-10-24 1984-10-24 半導体装置の製造方法 Granted JPS61101062A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22218184A JPS61101062A (ja) 1984-10-24 1984-10-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22218184A JPS61101062A (ja) 1984-10-24 1984-10-24 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61101062A JPS61101062A (ja) 1986-05-19
JPH0471340B2 true JPH0471340B2 (cs) 1992-11-13

Family

ID=16778426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22218184A Granted JPS61101062A (ja) 1984-10-24 1984-10-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61101062A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625652U (cs) * 1985-06-26 1987-01-14
JP7615015B2 (ja) 2021-12-07 2025-01-16 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756532U (cs) * 1980-09-22 1982-04-02

Also Published As

Publication number Publication date
JPS61101062A (ja) 1986-05-19

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