JPH0470124B2 - - Google Patents

Info

Publication number
JPH0470124B2
JPH0470124B2 JP58244022A JP24402283A JPH0470124B2 JP H0470124 B2 JPH0470124 B2 JP H0470124B2 JP 58244022 A JP58244022 A JP 58244022A JP 24402283 A JP24402283 A JP 24402283A JP H0470124 B2 JPH0470124 B2 JP H0470124B2
Authority
JP
Japan
Prior art keywords
firing
ceramic
parts
glass
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58244022A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60137884A (ja
Inventor
Nobuyuki Ushifusa
Satoru Ogiwara
Kosei Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24402283A priority Critical patent/JPS60137884A/ja
Publication of JPS60137884A publication Critical patent/JPS60137884A/ja
Publication of JPH0470124B2 publication Critical patent/JPH0470124B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP24402283A 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法 Granted JPS60137884A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24402283A JPS60137884A (ja) 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24402283A JPS60137884A (ja) 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法

Publications (2)

Publication Number Publication Date
JPS60137884A JPS60137884A (ja) 1985-07-22
JPH0470124B2 true JPH0470124B2 (cg-RX-API-DMAC10.html) 1992-11-10

Family

ID=17112540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24402283A Granted JPS60137884A (ja) 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法

Country Status (1)

Country Link
JP (1) JPS60137884A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247196A (ja) * 1985-08-26 1987-02-28 松下電器産業株式会社 セラミツク多層基板
JPH079382Y2 (ja) * 1987-12-28 1995-03-06 日本特殊陶業株式会社 セラミック基板
TW276356B (cg-RX-API-DMAC10.html) * 1994-06-24 1996-05-21 Ibm

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340436A (en) * 1980-07-14 1982-07-20 International Business Machines Corporation Process for flattening glass-ceramic substrates
JPS5724526A (en) * 1980-07-22 1982-02-09 Tdk Electronics Co Ltd Method of producing laminated porcelain condenser
JPS57135777A (en) * 1981-02-13 1982-08-21 Hitachi Ltd Ceramic board sintering method
JPS57190400A (en) * 1981-05-20 1982-11-22 Nippon Electric Co Method of producing ceramic substrate
JPS58151099A (ja) * 1982-03-03 1983-09-08 日立化成工業株式会社 セラミツク多層配線板の製造法

Also Published As

Publication number Publication date
JPS60137884A (ja) 1985-07-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term