JPH0469838B2 - - Google Patents

Info

Publication number
JPH0469838B2
JPH0469838B2 JP62250573A JP25057387A JPH0469838B2 JP H0469838 B2 JPH0469838 B2 JP H0469838B2 JP 62250573 A JP62250573 A JP 62250573A JP 25057387 A JP25057387 A JP 25057387A JP H0469838 B2 JPH0469838 B2 JP H0469838B2
Authority
JP
Japan
Prior art keywords
base material
circuit
conductor
conductive base
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62250573A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0194695A (ja
Inventor
Tatsuo Wada
Masamitsu Takenaka
Toshiro Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Priority to JP25057387A priority Critical patent/JPH0194695A/ja
Publication of JPH0194695A publication Critical patent/JPH0194695A/ja
Publication of JPH0469838B2 publication Critical patent/JPH0469838B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP25057387A 1987-10-06 1987-10-06 導体回路板の製造方法 Granted JPH0194695A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25057387A JPH0194695A (ja) 1987-10-06 1987-10-06 導体回路板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25057387A JPH0194695A (ja) 1987-10-06 1987-10-06 導体回路板の製造方法

Publications (2)

Publication Number Publication Date
JPH0194695A JPH0194695A (ja) 1989-04-13
JPH0469838B2 true JPH0469838B2 (enrdf_load_stackoverflow) 1992-11-09

Family

ID=17209898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25057387A Granted JPH0194695A (ja) 1987-10-06 1987-10-06 導体回路板の製造方法

Country Status (1)

Country Link
JP (1) JPH0194695A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100601485B1 (ko) * 2004-12-30 2006-07-18 삼성전기주식회사 Ｂｇａ 패키지 기판 및 그 제조방법
KR100782403B1 (ko) * 2006-10-25 2007-12-07 삼성전기주식회사 회로기판 제조방법
KR100782407B1 (ko) * 2006-10-30 2007-12-05 삼성전기주식회사 회로기판 제조방법
KR100966336B1 (ko) * 2008-04-07 2010-06-28 삼성전기주식회사 고밀도 회로기판 및 그 형성방법
JP6381997B2 (ja) * 2014-06-30 2018-08-29 京セラ株式会社 印刷配線板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249468A (en) * 1975-10-20 1977-04-20 Fujitsu Ltd Method of producing bothhside printed circuit board
JPS5939917B2 (ja) * 1980-12-29 1984-09-27 株式会社小糸製作所 プリント回路用導体及びその導体を用いたプリント回路板

Also Published As

Publication number Publication date
JPH0194695A (ja) 1989-04-13

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