JPH0468776B2 - - Google Patents

Info

Publication number
JPH0468776B2
JPH0468776B2 JP546383A JP546383A JPH0468776B2 JP H0468776 B2 JPH0468776 B2 JP H0468776B2 JP 546383 A JP546383 A JP 546383A JP 546383 A JP546383 A JP 546383A JP H0468776 B2 JPH0468776 B2 JP H0468776B2
Authority
JP
Japan
Prior art keywords
tool
arm
bonding
linear motor
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP546383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59130433A (ja
Inventor
Tomio Kashihara
Katsuhiko Aoyanagi
Nobushi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58005463A priority Critical patent/JPS59130433A/ja
Publication of JPS59130433A publication Critical patent/JPS59130433A/ja
Publication of JPH0468776B2 publication Critical patent/JPH0468776B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58005463A 1983-01-17 1983-01-17 ワイヤボンディング装置 Granted JPS59130433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58005463A JPS59130433A (ja) 1983-01-17 1983-01-17 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58005463A JPS59130433A (ja) 1983-01-17 1983-01-17 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPS59130433A JPS59130433A (ja) 1984-07-27
JPH0468776B2 true JPH0468776B2 (xx) 1992-11-04

Family

ID=11611919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58005463A Granted JPS59130433A (ja) 1983-01-17 1983-01-17 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JPS59130433A (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150838A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 検出方法および装置
JP2522330B2 (ja) * 1987-11-16 1996-08-07 三菱電機株式会社 ワイヤボンデイング装置
JPH01175239A (ja) * 1987-11-19 1989-07-11 Shinkawa Ltd ボンデイング装置
US5148967A (en) * 1991-07-15 1992-09-22 Hughes Aircraft Company Apparatus and method for detecting missing interconnect material
EP0864392B1 (en) * 1997-03-13 2001-08-16 F & K Delvotec Bondtechnik GmbH Bonding head

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619631A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Wire bonding device
JPS5630735A (en) * 1979-08-21 1981-03-27 Nec Corp Wire-bonding device
JPS5737250B2 (xx) * 1976-10-19 1982-08-09
JPS57188840A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Load variable mechanism in wire bonder

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918677Y2 (ja) * 1980-08-12 1984-05-30 株式会社東芝 ワイヤボンデイング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737250B2 (xx) * 1976-10-19 1982-08-09
JPS5619631A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Wire bonding device
JPS5630735A (en) * 1979-08-21 1981-03-27 Nec Corp Wire-bonding device
JPS57188840A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Load variable mechanism in wire bonder

Also Published As

Publication number Publication date
JPS59130433A (ja) 1984-07-27

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