JPS5619631A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5619631A
JPS5619631A JP9500779A JP9500779A JPS5619631A JP S5619631 A JPS5619631 A JP S5619631A JP 9500779 A JP9500779 A JP 9500779A JP 9500779 A JP9500779 A JP 9500779A JP S5619631 A JPS5619631 A JP S5619631A
Authority
JP
Japan
Prior art keywords
cam
bond
signal
pressure
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9500779A
Other languages
Japanese (ja)
Inventor
Yuzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9500779A priority Critical patent/JPS5619631A/en
Publication of JPS5619631A publication Critical patent/JPS5619631A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To bond wires optimumly by allowing a bonding arm to make contact with a cam without delay at high speed. CONSTITUTION:An XY base is moved to place a capillary 3 on upper portion of the first pad to drive a cam 4. An output is produced to a line l1 on the basis of program 12 by a timing signal T1. Thus, a relay RY1 is operated to input a current I1 to an operational amplifier 13 so as to rotate a motor 15. Thus, the wire 10 is wound to apply tension thereto to bond the wire under pressure p1. The pressure p1 is so selected as to set p1>p0, where the p0 represents the pressure at the time of bonding ordinarily so as to sufficiently bond even if the cam 4 is rotated at transient speed. The signal T1 is released, a signal T2 is applied to the line l2 to operate a relay RY2 so as to flow a current I2 through an operational amplifier 13 so as to drive a motor to apply a load p0 thereto. With a signal T3, the middle value between the load p0 and the pressure p1 is applied thereto so that no trouble occurs even if the vibration at the time of moving the arm 1 is retained. Predetermined following weight is applied thereto except bonding time to make always the lever contact with the cam 4 to follow it to eliminate the arm 1 to undesirably vibrate. This configuration can bond the wire optimumly.
JP9500779A 1979-07-27 1979-07-27 Wire bonding device Pending JPS5619631A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9500779A JPS5619631A (en) 1979-07-27 1979-07-27 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9500779A JPS5619631A (en) 1979-07-27 1979-07-27 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS5619631A true JPS5619631A (en) 1981-02-24

Family

ID=14125872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9500779A Pending JPS5619631A (en) 1979-07-27 1979-07-27 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5619631A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57206041A (en) * 1981-06-12 1982-12-17 Matsushita Electric Ind Co Ltd Cam following device in bonding device
JPS59130433A (en) * 1983-01-17 1984-07-27 Toshiba Corp Wire bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57206041A (en) * 1981-06-12 1982-12-17 Matsushita Electric Ind Co Ltd Cam following device in bonding device
JPS59130433A (en) * 1983-01-17 1984-07-27 Toshiba Corp Wire bonding device
JPH0468776B2 (en) * 1983-01-17 1992-11-04 Tokyo Shibaura Electric Co

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