JPH0467772B2 - - Google Patents

Info

Publication number
JPH0467772B2
JPH0467772B2 JP60215002A JP21500285A JPH0467772B2 JP H0467772 B2 JPH0467772 B2 JP H0467772B2 JP 60215002 A JP60215002 A JP 60215002A JP 21500285 A JP21500285 A JP 21500285A JP H0467772 B2 JPH0467772 B2 JP H0467772B2
Authority
JP
Japan
Prior art keywords
alignment
pattern
wafer
position detection
detection error
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60215002A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6276622A (ja
Inventor
Toshihiko Nakada
Yoshitada Oshida
Masataka Shiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60215002A priority Critical patent/JPS6276622A/ja
Publication of JPS6276622A publication Critical patent/JPS6276622A/ja
Publication of JPH0467772B2 publication Critical patent/JPH0467772B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP60215002A 1985-09-30 1985-09-30 縮小投影式アライメント方法及びその装置 Granted JPS6276622A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60215002A JPS6276622A (ja) 1985-09-30 1985-09-30 縮小投影式アライメント方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60215002A JPS6276622A (ja) 1985-09-30 1985-09-30 縮小投影式アライメント方法及びその装置

Publications (2)

Publication Number Publication Date
JPS6276622A JPS6276622A (ja) 1987-04-08
JPH0467772B2 true JPH0467772B2 (enExample) 1992-10-29

Family

ID=16665076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60215002A Granted JPS6276622A (ja) 1985-09-30 1985-09-30 縮小投影式アライメント方法及びその装置

Country Status (1)

Country Link
JP (1) JPS6276622A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2683075B2 (ja) * 1988-12-23 1997-11-26 キヤノン株式会社 半導体製造装置及び方法
US7728953B2 (en) 2004-03-01 2010-06-01 Nikon Corporation Exposure method, exposure system, and substrate processing apparatus
WO2005083756A1 (ja) * 2004-03-01 2005-09-09 Nikon Corporation 事前計測処理方法、露光システム及び基板処理装置

Also Published As

Publication number Publication date
JPS6276622A (ja) 1987-04-08

Similar Documents

Publication Publication Date Title
US6356343B1 (en) Mark for position detection and mark detecting method and apparatus
JP3796363B2 (ja) 位置検出装置及びそれを用いた露光装置
JPH0785466B2 (ja) 位置合せ装置
US20030193655A1 (en) Exposure apparatus and method
US5745242A (en) Position detecting system and exposure apparatus having the same
JP3271348B2 (ja) レベリング合わせ面計測方法及び露光装置
US7106419B2 (en) Exposure method and apparatus
JPH10189443A (ja) 位置検出用マーク、マーク検出方法及びその装置並びに露光装置
US6243158B1 (en) Projection exposure apparatus and method
JPH0467772B2 (enExample)
JPH0230112A (ja) 露光条件測定方法
US7313873B2 (en) Surface position measuring method, exposure apparatus, and device manufacturing method
JP7353916B2 (ja) 計測装置、リソグラフィ装置、及び物品の製造方法
JP2629709B2 (ja) 位置合わせ方法及び装置
JP2004279166A (ja) 位置検出装置
JPH10335234A (ja) 投影露光装置
JP3039305B2 (ja) 位置合わせ装置及びそれを用いた半導体デバイスの製造方法
JP3352161B2 (ja) 露光装置及びそれを用いた半導体チップの製造方法
JP2819592B2 (ja) 位置合わせ装置
JPH02152220A (ja) 位置合せ方法
JP3239449B2 (ja) 露光装置及びそれを用いた半導体チップの製造方法
JP2634791B2 (ja) 投影式アライメント方法及びその装置
JPS63146438A (ja) 位置合わせ方法
JPH10223510A (ja) 露光装置
JPS58162954A (ja) 投影型露光装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term