JPH0465543B2 - - Google Patents

Info

Publication number
JPH0465543B2
JPH0465543B2 JP2004582A JP458290A JPH0465543B2 JP H0465543 B2 JPH0465543 B2 JP H0465543B2 JP 2004582 A JP2004582 A JP 2004582A JP 458290 A JP458290 A JP 458290A JP H0465543 B2 JPH0465543 B2 JP H0465543B2
Authority
JP
Japan
Prior art keywords
copper
ceramic
semiconductor element
pin
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340454A (ja
Inventor
Toshiro Kuroda
Koichi Kumazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP458290A priority Critical patent/JPH0340454A/ja
Publication of JPH0340454A publication Critical patent/JPH0340454A/ja
Publication of JPH0465543B2 publication Critical patent/JPH0465543B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP458290A 1990-01-16 1990-01-16 ピン、グリッドアレイパッケージ Granted JPH0340454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP458290A JPH0340454A (ja) 1990-01-16 1990-01-16 ピン、グリッドアレイパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP458290A JPH0340454A (ja) 1990-01-16 1990-01-16 ピン、グリッドアレイパッケージ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57157684A Division JPS5946050A (ja) 1982-09-09 1982-09-09 半導体用セラミツクパツケ−ジ

Publications (2)

Publication Number Publication Date
JPH0340454A JPH0340454A (ja) 1991-02-21
JPH0465543B2 true JPH0465543B2 (enrdf_load_stackoverflow) 1992-10-20

Family

ID=11588034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP458290A Granted JPH0340454A (ja) 1990-01-16 1990-01-16 ピン、グリッドアレイパッケージ

Country Status (1)

Country Link
JP (1) JPH0340454A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5062776A (enrdf_load_stackoverflow) * 1973-10-05 1975-05-28

Also Published As

Publication number Publication date
JPH0340454A (ja) 1991-02-21

Similar Documents

Publication Publication Date Title
US4827082A (en) Ceramic package
JPS6327860B2 (enrdf_load_stackoverflow)
US5111277A (en) Surface mount device with high thermal conductivity
US5188985A (en) Surface mount device with high thermal conductivity
JP6907546B2 (ja) パワーモジュール
US11315868B2 (en) Electronic-component-mounted module design to reduce linear expansion coefficient mismatches
JPH06296084A (ja) 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
JPH0769750A (ja) セラミック接合構造体
JPH0465544B2 (enrdf_load_stackoverflow)
JPH0465543B2 (enrdf_load_stackoverflow)
JP7340009B2 (ja) 電子部品モジュール、及び、窒化珪素回路基板
JP2012064616A (ja) 高放熱型電子部品収納用パッケージ
CN112352309B (zh) 基体以及半导体装置
JPH0348448A (ja) Ｃｃｄパッケージ
JP2000183253A (ja) 半導体素子収納用パッケージ
JP2517024B2 (ja) セラミックパッケ―ジとその製造方法
JP3695706B2 (ja) 半導体パッケージ
JPH0340455A (ja) セラミックチップキャリヤー
JP2005252121A (ja) 半導体素子収納用パッケージ及びその製造方法
JPH0997865A (ja) 放熱部品
TWI745572B (zh) 電子零件安裝模組
JPH06196585A (ja) 回路基板
JPH05211248A (ja) 半導体搭載用複合放熱基板及びその製造方法
JP2525232B2 (ja) セラミックパッケ―ジおよびその製造方法
JPH0412682Y2 (enrdf_load_stackoverflow)