JPH0465537B2 - - Google Patents

Info

Publication number
JPH0465537B2
JPH0465537B2 JP62200004A JP20000487A JPH0465537B2 JP H0465537 B2 JPH0465537 B2 JP H0465537B2 JP 62200004 A JP62200004 A JP 62200004A JP 20000487 A JP20000487 A JP 20000487A JP H0465537 B2 JPH0465537 B2 JP H0465537B2
Authority
JP
Japan
Prior art keywords
bonding
wedge
wire
tip
predetermined length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62200004A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6444032A (en
Inventor
Hideaki Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP62200004A priority Critical patent/JPS6444032A/ja
Publication of JPS6444032A publication Critical patent/JPS6444032A/ja
Publication of JPH0465537B2 publication Critical patent/JPH0465537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/5363—

Landscapes

  • Wire Bonding (AREA)
JP62200004A 1987-08-12 1987-08-12 Wire bonding method Granted JPS6444032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62200004A JPS6444032A (en) 1987-08-12 1987-08-12 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62200004A JPS6444032A (en) 1987-08-12 1987-08-12 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS6444032A JPS6444032A (en) 1989-02-16
JPH0465537B2 true JPH0465537B2 (cg-RX-API-DMAC10.html) 1992-10-20

Family

ID=16417195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62200004A Granted JPS6444032A (en) 1987-08-12 1987-08-12 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS6444032A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS6444032A (en) 1989-02-16

Similar Documents

Publication Publication Date Title
JP3400279B2 (ja) バンプ形成方法
US5024367A (en) Wire bonding method
JPH07153800A (ja) ボンディングツール
JPH0465537B2 (cg-RX-API-DMAC10.html)
JP2998942B2 (ja) ボンディングツール及びそれを用いたボンディング方法
JPH054814B2 (cg-RX-API-DMAC10.html)
JPS6052585B2 (ja) ワイヤボンディング法
JPS5919463B2 (ja) ワイヤボンデイング方法
JPH05860B2 (cg-RX-API-DMAC10.html)
JP2537389B2 (ja) ワイヤボンディング方法及びその装置
JP2574054B2 (ja) ワイヤボンダ及びワイヤボンディング方法
CN105990167A (zh) 导线键合装置及半导体装置
JP2925392B2 (ja) ボール式ワイヤボンディング方法
JPS62156828A (ja) ワイヤボンデイング装置
JPH0244744A (ja) ワイヤボンディング方法
JPH0228338A (ja) ワイヤボンディング方法
JPH11168119A (ja) ワイヤボンディング方法とそれに用いる押圧ツール
JPS59144141A (ja) ワイヤボンデイング装置
JPS6233742B2 (cg-RX-API-DMAC10.html)
JPS59130435A (ja) 超音波ワイヤボンダ用ウエツジ
JP3332185B2 (ja) 弾性加圧接触式端子接続方法
JPS6345001Y2 (cg-RX-API-DMAC10.html)
JPS62108533A (ja) ワイヤボンデイング方法
JP2513785B2 (ja) 超音波ワイヤボンディング方法
JPH10175083A (ja) 超音波溶接方法及び溶接機