JPH0464121B2 - - Google Patents

Info

Publication number
JPH0464121B2
JPH0464121B2 JP61208896A JP20889686A JPH0464121B2 JP H0464121 B2 JPH0464121 B2 JP H0464121B2 JP 61208896 A JP61208896 A JP 61208896A JP 20889686 A JP20889686 A JP 20889686A JP H0464121 B2 JPH0464121 B2 JP H0464121B2
Authority
JP
Japan
Prior art keywords
wire
ball
bonding
annealing
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61208896A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364211A (ja
Inventor
Tooru Tanigawa
Shoji Shiga
Masaaki Kurihara
Kozo Okuda
Ichiro Kaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP61208896A priority Critical patent/JPS6364211A/ja
Publication of JPS6364211A publication Critical patent/JPS6364211A/ja
Publication of JPH0464121B2 publication Critical patent/JPH0464121B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H10W72/01551—
    • H10W72/50—
    • H10W72/5525—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP61208896A 1986-09-05 1986-09-05 銅細線とその製造方法 Granted JPS6364211A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61208896A JPS6364211A (ja) 1986-09-05 1986-09-05 銅細線とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61208896A JPS6364211A (ja) 1986-09-05 1986-09-05 銅細線とその製造方法

Publications (2)

Publication Number Publication Date
JPS6364211A JPS6364211A (ja) 1988-03-22
JPH0464121B2 true JPH0464121B2 (esLanguage) 1992-10-14

Family

ID=16563924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61208896A Granted JPS6364211A (ja) 1986-09-05 1986-09-05 銅細線とその製造方法

Country Status (1)

Country Link
JP (1) JPS6364211A (esLanguage)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3050554B2 (ja) * 1988-04-13 2000-06-12 日立電線株式会社 マグネットワイヤ
US6113761A (en) 1999-06-02 2000-09-05 Johnson Matthey Electronics, Inc. Copper sputtering target assembly and method of making same
US6858102B1 (en) 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
AU1609501A (en) 1999-11-24 2001-06-04 Honeywell International, Inc. Physical vapor deposition targets, conductive integrated circuit metal alloy interconnections, electroplating anodes, and metal alloys for use as a conductive interconnection in an integrated circuit
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー
JP5152897B2 (ja) * 2006-11-21 2013-02-27 タツタ電線株式会社 銅ボンディングワイヤ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JP2656237B2 (ja) * 1985-10-30 1997-09-24 株式会社東芝 半導体装置
JP2656236B2 (ja) * 1985-10-30 1997-09-24 株式会社東芝 半導体装置
JP2656238B2 (ja) * 1985-10-30 1997-09-24 株式会社東芝 半導体装置
JPH0717976B2 (ja) * 1985-12-18 1995-03-01 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
JPS6364211A (ja) 1988-03-22

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