JPH046223Y2 - - Google Patents

Info

Publication number
JPH046223Y2
JPH046223Y2 JP1986023288U JP2328886U JPH046223Y2 JP H046223 Y2 JPH046223 Y2 JP H046223Y2 JP 1986023288 U JP1986023288 U JP 1986023288U JP 2328886 U JP2328886 U JP 2328886U JP H046223 Y2 JPH046223 Y2 JP H046223Y2
Authority
JP
Japan
Prior art keywords
plating
axis
jig
printed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986023288U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62136568U (esLanguage
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986023288U priority Critical patent/JPH046223Y2/ja
Publication of JPS62136568U publication Critical patent/JPS62136568U/ja
Application granted granted Critical
Publication of JPH046223Y2 publication Critical patent/JPH046223Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1986023288U 1986-02-19 1986-02-19 Expired JPH046223Y2 (esLanguage)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986023288U JPH046223Y2 (esLanguage) 1986-02-19 1986-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986023288U JPH046223Y2 (esLanguage) 1986-02-19 1986-02-19

Publications (2)

Publication Number Publication Date
JPS62136568U JPS62136568U (esLanguage) 1987-08-28
JPH046223Y2 true JPH046223Y2 (esLanguage) 1992-02-20

Family

ID=30821456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986023288U Expired JPH046223Y2 (esLanguage) 1986-02-19 1986-02-19

Country Status (1)

Country Link
JP (1) JPH046223Y2 (esLanguage)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020105524A1 (ja) * 2018-11-20 2020-05-28 アルメックスＰｅ株式会社 治具搬送部材並びに表面処理装置及び方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124472U (ja) * 1982-02-19 1983-08-24 上村工業株式会社 メツキ処理装置
JPS61206298A (ja) * 1985-03-11 1986-09-12 日立化成工業株式会社 板状体の小径穴内薬液処理法

Also Published As

Publication number Publication date
JPS62136568U (esLanguage) 1987-08-28

Similar Documents

Publication Publication Date Title
KR100296780B1 (ko) 도금방법및도금장치
GB2123036A (en) Electroplating non-metallic surfaces
JPH046223Y2 (esLanguage)
EP0446522B1 (en) Electroless copper plating process
US20060046481A1 (en) Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards
US6292372B1 (en) Solder thieving pad for wave soldered through-hole components
US4878851A (en) Electrical socket apparatus with temporary housing
JP3079698B2 (ja) プリント配線板の表面処理装置
KR900005846B1 (ko) 고속도금방법
JPH09307209A (ja) 電子部品の実装構造及び実装方法
JPS5810848A (ja) 混成集積回路用リ−ドピン
CN219497733U (zh) 一种金属剥离浸泡治具
JPH0719690Y2 (ja) ユニバーサル型基板吸着治具
JP2002261436A (ja) プリント基板の電子部品実装方法と半田付け方法及び連結手段を有するプリント基板
CN115182030B (zh) 基板夹具装置
CN221529895U (zh) 一种应用于晶圆级表面贴装技术的载具及真空台
JP7090834B1 (ja) めっき装置
JPS6232690A (ja) プリント基板のめつき方法
JPH0319707A (ja) 印刷配線板の穴あけ装置
CN218183630U (zh) 一种沉金工艺中的多层pcb板
JPH08104998A (ja) 薄形基板のめっき装置
JP3250265B2 (ja) プリント配線板の製造法
Chinda et al. Investigation of high reliability micro bump plating technique on tape carrier
JPH0511661Y2 (esLanguage)
JPS635867A (ja) 自動半田付装置