JPH0461498B2 - - Google Patents
Info
- Publication number
- JPH0461498B2 JPH0461498B2 JP7240986A JP7240986A JPH0461498B2 JP H0461498 B2 JPH0461498 B2 JP H0461498B2 JP 7240986 A JP7240986 A JP 7240986A JP 7240986 A JP7240986 A JP 7240986A JP H0461498 B2 JPH0461498 B2 JP H0461498B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- parts
- atmosphere
- heated
- forming cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012298 atmosphere Substances 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 238000007664 blowing Methods 0.000 claims abstract description 3
- 238000005192 partition Methods 0.000 claims description 6
- 238000000638 solvent extraction Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000002618 waking effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7240986A JPS62232132A (ja) | 1986-04-01 | 1986-04-01 | 雰囲気形成カバ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7240986A JPS62232132A (ja) | 1986-04-01 | 1986-04-01 | 雰囲気形成カバ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62232132A JPS62232132A (ja) | 1987-10-12 |
| JPH0461498B2 true JPH0461498B2 (enrdf_load_stackoverflow) | 1992-10-01 |
Family
ID=13488453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7240986A Granted JPS62232132A (ja) | 1986-04-01 | 1986-04-01 | 雰囲気形成カバ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62232132A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100596326B1 (ko) | 2004-08-20 | 2006-07-06 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
-
1986
- 1986-04-01 JP JP7240986A patent/JPS62232132A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62232132A (ja) | 1987-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101139612B1 (ko) | 면형상 히터 | |
| US5187771A (en) | Heat processing apparatus utilizing a plurality of stacked heater holders | |
| JPS5832518A (ja) | 押出型材の製造方法 | |
| JPH0461498B2 (enrdf_load_stackoverflow) | ||
| US3404974A (en) | Cooling arrangement for glass forming equipment | |
| US4504427A (en) | Solder preform stabilization for lead frames | |
| JP2756566B2 (ja) | 縦型熱処理装置 | |
| US3383497A (en) | Electric resistance heaters | |
| US3022982A (en) | Heat exchanger element and applications thereof | |
| JPH01186175A (ja) | トランジスタインバータ装置 | |
| JPH0710564A (ja) | 光学素子の成形装置 | |
| JP3108134B2 (ja) | 縦型電気炉 | |
| JP2630009B2 (ja) | 拡散処理装置 | |
| JPH02175869A (ja) | 基板冷却装置 | |
| JPH04139864A (ja) | 半導体装置 | |
| JP2002195754A (ja) | ベルト式焼結炉の炉心管 | |
| JPH09191072A (ja) | リードフレーム | |
| JPS6325937A (ja) | 半導体装置用ワイヤボンダ− | |
| JPS6376338A (ja) | 半導体用加熱装置 | |
| JPH047102B2 (enrdf_load_stackoverflow) | ||
| JPS6026977Y2 (ja) | フイルム冷却装置 | |
| JP2576973Y2 (ja) | ワイヤボンディング装置 | |
| JPH02153848A (ja) | 光ファイバの製造方法 | |
| JPH0639502Y2 (ja) | ヒートシンク | |
| JP2004311321A (ja) | 発熱体 |