JPS62232132A - 雰囲気形成カバ− - Google Patents
雰囲気形成カバ−Info
- Publication number
- JPS62232132A JPS62232132A JP7240986A JP7240986A JPS62232132A JP S62232132 A JPS62232132 A JP S62232132A JP 7240986 A JP7240986 A JP 7240986A JP 7240986 A JP7240986 A JP 7240986A JP S62232132 A JPS62232132 A JP S62232132A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- parts
- atmosphere
- heated
- forming cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012298 atmosphere Substances 0.000 title claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000007664 blowing Methods 0.000 claims abstract description 3
- 238000000638 solvent extraction Methods 0.000 claims abstract description 3
- 238000005192 partition Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7240986A JPS62232132A (ja) | 1986-04-01 | 1986-04-01 | 雰囲気形成カバ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7240986A JPS62232132A (ja) | 1986-04-01 | 1986-04-01 | 雰囲気形成カバ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62232132A true JPS62232132A (ja) | 1987-10-12 |
| JPH0461498B2 JPH0461498B2 (enrdf_load_stackoverflow) | 1992-10-01 |
Family
ID=13488453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7240986A Granted JPS62232132A (ja) | 1986-04-01 | 1986-04-01 | 雰囲気形成カバ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62232132A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100596326B1 (ko) | 2004-08-20 | 2006-07-06 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
-
1986
- 1986-04-01 JP JP7240986A patent/JPS62232132A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100596326B1 (ko) | 2004-08-20 | 2006-07-06 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0461498B2 (enrdf_load_stackoverflow) | 1992-10-01 |
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