JPH046116B2 - - Google Patents

Info

Publication number
JPH046116B2
JPH046116B2 JP59173405A JP17340584A JPH046116B2 JP H046116 B2 JPH046116 B2 JP H046116B2 JP 59173405 A JP59173405 A JP 59173405A JP 17340584 A JP17340584 A JP 17340584A JP H046116 B2 JPH046116 B2 JP H046116B2
Authority
JP
Japan
Prior art keywords
adhesive
oxidizing agent
insulating substrate
rubber
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59173405A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6151990A (ja
Inventor
Mineo Kawamoto
Kanji Murakami
Haruo Akaboshi
Akio Tadokoro
Motoyo Wajima
Shoji Kawakubo
Makoto Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17340584A priority Critical patent/JPS6151990A/ja
Publication of JPS6151990A publication Critical patent/JPS6151990A/ja
Publication of JPH046116B2 publication Critical patent/JPH046116B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP17340584A 1984-08-22 1984-08-22 表面を金属化した絶縁基板の製造方法 Granted JPS6151990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17340584A JPS6151990A (ja) 1984-08-22 1984-08-22 表面を金属化した絶縁基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17340584A JPS6151990A (ja) 1984-08-22 1984-08-22 表面を金属化した絶縁基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6151990A JPS6151990A (ja) 1986-03-14
JPH046116B2 true JPH046116B2 (enrdf_load_stackoverflow) 1992-02-04

Family

ID=15959812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17340584A Granted JPS6151990A (ja) 1984-08-22 1984-08-22 表面を金属化した絶縁基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6151990A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11441015B2 (en) 2018-01-12 2022-09-13 Ajinomoto Co., Inc. Coated particle

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS641599A (en) * 1987-06-25 1989-01-05 Kawatetsu Galvanizing Co Ltd Manufacture of marking board with sunken lines
JPS6447095A (en) * 1987-08-18 1989-02-21 Ibiden Co Ltd Printed wiring board and manufacture thereof
JPH0634447B2 (ja) * 1987-08-31 1994-05-02 イビデン株式会社 アディティブ用接着剤、これを使用したアディティブ用基材及びプリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724074B2 (enrdf_load_stackoverflow) * 1972-10-24 1982-05-21
JPS53100470A (en) * 1977-02-14 1978-09-01 Hitachi Ltd Method of producing printed board and coating agent used therefor
JPS5420650A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Input circuit
JPS5724074A (en) * 1980-07-15 1982-02-08 Toshiba Corp Program selecting device
JPS584733A (ja) * 1981-06-29 1983-01-11 Shin Etsu Chem Co Ltd アルキニル化合物の製造方法
JPS60210449A (ja) * 1984-04-05 1985-10-22 住友ベークライト株式会社 アデイテイブめつき用積層板の製造方法
JPS60217695A (ja) * 1984-04-13 1985-10-31 株式会社日立製作所 無電解めつき前処理法及びプリント配線板の製造法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11441015B2 (en) 2018-01-12 2022-09-13 Ajinomoto Co., Inc. Coated particle

Also Published As

Publication number Publication date
JPS6151990A (ja) 1986-03-14

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