JPH0458687B2 - - Google Patents

Info

Publication number
JPH0458687B2
JPH0458687B2 JP59063857A JP6385784A JPH0458687B2 JP H0458687 B2 JPH0458687 B2 JP H0458687B2 JP 59063857 A JP59063857 A JP 59063857A JP 6385784 A JP6385784 A JP 6385784A JP H0458687 B2 JPH0458687 B2 JP H0458687B2
Authority
JP
Japan
Prior art keywords
sliding ring
main shaft
gripper
support rod
grippers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59063857A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60206139A (ja
Inventor
Seiichiro Sogo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUROTANI NOBUKO
Original Assignee
KUROTANI NOBUKO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUROTANI NOBUKO filed Critical KUROTANI NOBUKO
Priority to JP59063857A priority Critical patent/JPS60206139A/ja
Publication of JPS60206139A publication Critical patent/JPS60206139A/ja
Publication of JPH0458687B2 publication Critical patent/JPH0458687B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Centrifugal Separators (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP59063857A 1984-03-30 1984-03-30 半導体材料の水切乾燥装置 Granted JPS60206139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59063857A JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59063857A JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Publications (2)

Publication Number Publication Date
JPS60206139A JPS60206139A (ja) 1985-10-17
JPH0458687B2 true JPH0458687B2 (enExample) 1992-09-18

Family

ID=13241424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59063857A Granted JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Country Status (1)

Country Link
JP (1) JPS60206139A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924852U (enExample) * 1972-06-10 1974-03-02
JPS5737837A (en) * 1980-08-20 1982-03-02 Toshiba Corp Drying device for semiconductor wafer

Also Published As

Publication number Publication date
JPS60206139A (ja) 1985-10-17

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