JPH0458188B2 - - Google Patents

Info

Publication number
JPH0458188B2
JPH0458188B2 JP62173941A JP17394187A JPH0458188B2 JP H0458188 B2 JPH0458188 B2 JP H0458188B2 JP 62173941 A JP62173941 A JP 62173941A JP 17394187 A JP17394187 A JP 17394187A JP H0458188 B2 JPH0458188 B2 JP H0458188B2
Authority
JP
Japan
Prior art keywords
base
terminal
layer
nickel
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62173941A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6323341A (ja
Inventor
Takuji Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP62173941A priority Critical patent/JPS6323341A/ja
Publication of JPS6323341A publication Critical patent/JPS6323341A/ja
Publication of JPH0458188B2 publication Critical patent/JPH0458188B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP62173941A 1987-07-14 1987-07-14 固体装置及びその製造方法 Granted JPS6323341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62173941A JPS6323341A (ja) 1987-07-14 1987-07-14 固体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62173941A JPS6323341A (ja) 1987-07-14 1987-07-14 固体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6323341A JPS6323341A (ja) 1988-01-30
JPH0458188B2 true JPH0458188B2 (ref) 1992-09-16

Family

ID=15969904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62173941A Granted JPS6323341A (ja) 1987-07-14 1987-07-14 固体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6323341A (ref)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783070B2 (ja) * 1988-02-22 1995-09-06 株式会社東芝 半導体装置
JP4863495B2 (ja) * 2007-04-23 2012-01-25 旭精機工業株式会社 気密封止リング及びその製造方法

Also Published As

Publication number Publication date
JPS6323341A (ja) 1988-01-30

Similar Documents

Publication Publication Date Title
JPS60257160A (ja) 半導体装置
US6560090B2 (en) Solid electrolytic capacitor and method of manufacturing same
JP3444826B2 (ja) アレイ型多重チップ素子及びその製造方法
JPH0249021B2 (ref)
JP4344560B2 (ja) 半導体チップおよびこれを用いた半導体装置
JP3115713B2 (ja) セラミック電子部品
JP5494559B2 (ja) 半導体装置およびその製造方法
JPH04246813A (ja) ヒューズ入り固体電解コンデンサ
JP5537119B2 (ja) 蓋体並びに蓋体の製造方法および電子装置の製造方法
JPS62266842A (ja) 半導体装置及びその製造方法
JPS6323341A (ja) 固体装置及びその製造方法
EP0214465B1 (en) Plating process for an electronic part
JPH08273947A (ja) 焼結体を有する電気部品及びその製造方法
JP4775369B2 (ja) 半導体チップ、半導体装置および製造方法
JPH0661089A (ja) セラミック電子部品
JPS624860B2 (ref)
JP2976400B2 (ja) セラミックチップコンデンサ及びその製造方法
JP2959028B2 (ja) チップ形固体電解コンデンサ
JP2003142614A (ja) 気密封止型電子部品
JPH0629769A (ja) チップ型電子部品
KR810002375Y1 (ko) 고체전해 콘덴서
JPS60195953A (ja) 半導体装置およびその製造方法
JP2004079965A (ja) 光半導体モジュールとその製造方法
JPH06349668A (ja) セラミック電子部品
JPH03248503A (ja) サーミスタ