JPH0458181B2 - - Google Patents

Info

Publication number
JPH0458181B2
JPH0458181B2 JP62007222A JP722287A JPH0458181B2 JP H0458181 B2 JPH0458181 B2 JP H0458181B2 JP 62007222 A JP62007222 A JP 62007222A JP 722287 A JP722287 A JP 722287A JP H0458181 B2 JPH0458181 B2 JP H0458181B2
Authority
JP
Japan
Prior art keywords
resin
mold
support plate
semiconductor chip
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62007222A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63175436A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP62007222A priority Critical patent/JPS63175436A/ja
Publication of JPS63175436A publication Critical patent/JPS63175436A/ja
Publication of JPH0458181B2 publication Critical patent/JPH0458181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5363—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP62007222A 1987-01-14 1987-01-14 樹脂封止型半導体装置の製造方法 Granted JPS63175436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62007222A JPS63175436A (ja) 1987-01-14 1987-01-14 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62007222A JPS63175436A (ja) 1987-01-14 1987-01-14 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS63175436A JPS63175436A (ja) 1988-07-19
JPH0458181B2 true JPH0458181B2 (OSRAM) 1992-09-16

Family

ID=11659967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62007222A Granted JPS63175436A (ja) 1987-01-14 1987-01-14 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS63175436A (OSRAM)

Also Published As

Publication number Publication date
JPS63175436A (ja) 1988-07-19

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