JPH0451978B2 - - Google Patents

Info

Publication number
JPH0451978B2
JPH0451978B2 JP57227428A JP22742882A JPH0451978B2 JP H0451978 B2 JPH0451978 B2 JP H0451978B2 JP 57227428 A JP57227428 A JP 57227428A JP 22742882 A JP22742882 A JP 22742882A JP H0451978 B2 JPH0451978 B2 JP H0451978B2
Authority
JP
Japan
Prior art keywords
substrate
groove
mask
forming
mask material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57227428A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59121848A (ja
Inventor
Ryozo Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP22742882A priority Critical patent/JPS59121848A/ja
Publication of JPS59121848A publication Critical patent/JPS59121848A/ja
Publication of JPH0451978B2 publication Critical patent/JPH0451978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
JP22742882A 1982-12-28 1982-12-28 半導体装置の製造方法 Granted JPS59121848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22742882A JPS59121848A (ja) 1982-12-28 1982-12-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22742882A JPS59121848A (ja) 1982-12-28 1982-12-28 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59121848A JPS59121848A (ja) 1984-07-14
JPH0451978B2 true JPH0451978B2 (enrdf_load_stackoverflow) 1992-08-20

Family

ID=16860692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22742882A Granted JPS59121848A (ja) 1982-12-28 1982-12-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59121848A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4721682A (en) * 1985-09-25 1988-01-26 Monolithic Memories, Inc. Isolation and substrate connection for a bipolar integrated circuit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149750A (en) * 1981-03-12 1982-09-16 Nippon Telegr & Teleph Corp <Ntt> Element isolating method

Also Published As

Publication number Publication date
JPS59121848A (ja) 1984-07-14

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