JPH0451612U - - Google Patents
Info
- Publication number
- JPH0451612U JPH0451612U JP9357990U JP9357990U JPH0451612U JP H0451612 U JPH0451612 U JP H0451612U JP 9357990 U JP9357990 U JP 9357990U JP 9357990 U JP9357990 U JP 9357990U JP H0451612 U JPH0451612 U JP H0451612U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- rays
- circuit board
- printed circuit
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
- 238000007689 inspection Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の説明図、第２図、第３図は従
来例の説明図である。
１……Ｘ線源、２……プリント基板、３……面
付部品のはんだ付部（ＩＣのリード）、４……は
んだ付部、５……良品フイレツト形状角度、６…
…フイレツト波形データ。
FIG. 1 is an explanatory diagram of the present invention, and FIGS. 2 and 3 are explanatory diagrams of a conventional example. 1... X-ray source, 2... Printed circuit board, 3... Soldered part of surface-mounted parts (IC leads), 4... Soldered part, 5... Good product fillet shape angle, 6...
...Fillet waveform data.
Claims (1)
面付部品のはんだ付状態を自動検査する装置にお
いてはんだに対し、該はんだにより形成されるフ
イレツトの表面にほぼ沿つた直線として想定され
る線に平行にＸ線を照射し、はんだ付の良否を判
定することを特徴とするはんだ付検査装置。 In a device that uses X-rays to automatically inspect the soldering condition of surface-mounted components soldered on a printed circuit board, a line that is assumed to be a straight line approximately along the surface of the fillet formed by the solder is detected. A soldering inspection device characterized by irradiating X-rays in parallel to determine the quality of soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9357990U JPH0451612U (en) | 1990-09-07 | 1990-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9357990U JPH0451612U (en) | 1990-09-07 | 1990-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451612U true JPH0451612U (en) | 1992-04-30 |
Family
ID=31830910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9357990U Pending JPH0451612U (en) | 1990-09-07 | 1990-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451612U (en) |
-
1990
- 1990-09-07 JP JP9357990U patent/JPH0451612U/ja active Pending
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