JPH0450336B2 - - Google Patents
Info
- Publication number
- JPH0450336B2 JPH0450336B2 JP59059782A JP5978284A JPH0450336B2 JP H0450336 B2 JPH0450336 B2 JP H0450336B2 JP 59059782 A JP59059782 A JP 59059782A JP 5978284 A JP5978284 A JP 5978284A JP H0450336 B2 JPH0450336 B2 JP H0450336B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- glass
- nonwoven fabric
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000004745 nonwoven fabric Substances 0.000 claims description 29
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 239000002966 varnish Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 9
- 238000005470 impregnation Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002759 woven fabric Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 2
- PBEHQFUSQJKBAS-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;phenol Chemical compound OC1=CC=CC=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 PBEHQFUSQJKBAS-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5978284A JPS60203641A (ja) | 1984-03-28 | 1984-03-28 | コンポジツト積層板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5978284A JPS60203641A (ja) | 1984-03-28 | 1984-03-28 | コンポジツト積層板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60203641A JPS60203641A (ja) | 1985-10-15 |
JPH0450336B2 true JPH0450336B2 (fr) | 1992-08-14 |
Family
ID=13123204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5978284A Granted JPS60203641A (ja) | 1984-03-28 | 1984-03-28 | コンポジツト積層板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60203641A (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63207830A (ja) * | 1987-02-24 | 1988-08-29 | Shin Kobe Electric Mach Co Ltd | 積層板の製造法 |
JPH03128239A (ja) * | 1989-10-16 | 1991-05-31 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4837135A (fr) * | 1971-09-09 | 1973-06-01 | ||
JPS50143871A (fr) * | 1974-05-10 | 1975-11-19 | ||
JPS55113526A (en) * | 1979-02-23 | 1980-09-02 | Matsushita Electric Works Ltd | Production of resin-impregnated blank material |
JPS58220730A (ja) * | 1982-06-17 | 1983-12-22 | 新神戸電機株式会社 | 積層板の製造法 |
-
1984
- 1984-03-28 JP JP5978284A patent/JPS60203641A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4837135A (fr) * | 1971-09-09 | 1973-06-01 | ||
JPS50143871A (fr) * | 1974-05-10 | 1975-11-19 | ||
JPS55113526A (en) * | 1979-02-23 | 1980-09-02 | Matsushita Electric Works Ltd | Production of resin-impregnated blank material |
JPS58220730A (ja) * | 1982-06-17 | 1983-12-22 | 新神戸電機株式会社 | 積層板の製造法 |
Also Published As
Publication number | Publication date |
---|---|
JPS60203641A (ja) | 1985-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |