JPH0449782B2 - - Google Patents

Info

Publication number
JPH0449782B2
JPH0449782B2 JP856785A JP856785A JPH0449782B2 JP H0449782 B2 JPH0449782 B2 JP H0449782B2 JP 856785 A JP856785 A JP 856785A JP 856785 A JP856785 A JP 856785A JP H0449782 B2 JPH0449782 B2 JP H0449782B2
Authority
JP
Japan
Prior art keywords
housing
casing
heat
base plate
control element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP856785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60165743A (ja
Inventor
Shuroipen Rihyaruto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS60165743A publication Critical patent/JPS60165743A/ja
Publication of JPH0449782B2 publication Critical patent/JPH0449782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP856785A 1984-01-26 1985-01-22 熱排出性の固定装置 Granted JPS60165743A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843402538 DE3402538A1 (de) 1984-01-26 1984-01-26 Waermeableitende befestigung
DE3402538.3 1984-01-26

Publications (2)

Publication Number Publication Date
JPS60165743A JPS60165743A (ja) 1985-08-28
JPH0449782B2 true JPH0449782B2 (enrdf_load_stackoverflow) 1992-08-12

Family

ID=6225896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP856785A Granted JPS60165743A (ja) 1984-01-26 1985-01-22 熱排出性の固定装置

Country Status (2)

Country Link
JP (1) JPS60165743A (enrdf_load_stackoverflow)
DE (1) DE3402538A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3633625A1 (de) * 1985-12-04 1987-06-11 Vdo Schindling Traegerplatte
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
JPWO2006103721A1 (ja) * 2005-03-25 2008-09-04 三菱電機株式会社 電力変換装置の冷却構造
WO2007110954A1 (ja) 2006-03-29 2007-10-04 Mitsubishi Denki Kabushiki Kaisha 電源装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1236612B (de) * 1960-02-24 1967-03-16 Globe Union Inc Befestigung eines Transistors innerhalb eines gedruckten Stromkreises in der Ausnehmung einer Isolierplatte
DE1156457B (de) * 1961-07-08 1963-10-31 Telefunken Patent Verfahren zur Herstellung einer integrierten Schaltungsanordnung
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
US3396361A (en) * 1966-12-05 1968-08-06 Solitron Devices Combined mounting support, heat sink, and electrical terminal connection assembly
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
US3936866A (en) * 1974-06-14 1976-02-03 Northrop Corporation Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
US4029999A (en) * 1975-04-10 1977-06-14 Ibm Corporation Thermally conducting elastomeric device
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
DE3151655A1 (de) * 1981-12-28 1983-07-07 Siemens AG, 1000 Berlin und 8000 München Anordnung zur kuehlung von bauelementengruppen
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics

Also Published As

Publication number Publication date
DE3402538A1 (de) 1985-08-01
JPS60165743A (ja) 1985-08-28
DE3402538C2 (enrdf_load_stackoverflow) 1993-04-01

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