JPH0446453B2 - - Google Patents

Info

Publication number
JPH0446453B2
JPH0446453B2 JP60173020A JP17302085A JPH0446453B2 JP H0446453 B2 JPH0446453 B2 JP H0446453B2 JP 60173020 A JP60173020 A JP 60173020A JP 17302085 A JP17302085 A JP 17302085A JP H0446453 B2 JPH0446453 B2 JP H0446453B2
Authority
JP
Japan
Prior art keywords
lead frame
presser
chip
frame
heat block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60173020A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233432A (ja
Inventor
Masanari Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60173020A priority Critical patent/JPS6233432A/ja
Publication of JPS6233432A publication Critical patent/JPS6233432A/ja
Publication of JPH0446453B2 publication Critical patent/JPH0446453B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/7622—
    • H10P72/50—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP60173020A 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器 Granted JPS6233432A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60173020A JPS6233432A (ja) 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60173020A JPS6233432A (ja) 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器

Publications (2)

Publication Number Publication Date
JPS6233432A JPS6233432A (ja) 1987-02-13
JPH0446453B2 true JPH0446453B2 (cg-RX-API-DMAC10.html) 1992-07-30

Family

ID=15952717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60173020A Granted JPS6233432A (ja) 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器

Country Status (1)

Country Link
JP (1) JPS6233432A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233947A (ja) * 1990-02-09 1991-10-17 Fujitsu Ltd リードフレームインナーリード押え治具
KR20020069885A (ko) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 반도체패키지용 클램프

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595976Y2 (ja) * 1975-12-26 1984-02-23 株式会社新川製作所 リ−ドフレ−ムオサエソウチ
JPS60113438A (ja) * 1983-11-24 1985-06-19 Nec Corp ベ−スリボン保持機構

Also Published As

Publication number Publication date
JPS6233432A (ja) 1987-02-13

Similar Documents

Publication Publication Date Title
JPH0446453B2 (cg-RX-API-DMAC10.html)
JPH03228339A (ja) ボンディングツール
JPS61163602A (ja) 電子部品の製造方法
JPS5856971B2 (ja) 半導体装置の製造方法
JP2731584B2 (ja) リードフレーム及びこれを用いた電子部品パッケージの製造方法
JP2897086B2 (ja) 電子部品へのリード線の位置決め固定方法
JPH0635382Y2 (ja) 混成集積回路のリード端子取付構造
JPS63278264A (ja) Ｍｏｓｆｅｔモジユ−ル
JPH0344414B2 (cg-RX-API-DMAC10.html)
JPH0442934Y2 (cg-RX-API-DMAC10.html)
JPH03233947A (ja) リードフレームインナーリード押え治具
JPS6344998Y2 (cg-RX-API-DMAC10.html)
JP3029023B2 (ja) ボンディングツール
JP3293757B2 (ja) 半導体装置製造用リードフレーム組立体の製造方法
JPH04324948A (ja) ボンディング方法
JPS62190735A (ja) テ−プキヤリア式半導体素子の実装方法
JPS61287212A (ja) 電子部品用リ−ドフレ−ム
KR20030001328A (ko) 높은 품질과 높은 생산성으로 ｔａｂ테이프들의내부리드들을 전극패드들에 접합할 수 있는 접합도구와접합방법
JPS6351648A (ja) 半導体装置の製造方法
JPH036034A (ja) ワイヤボンディング装置
JPS61255043A (ja) 電子部品装置
JPH0384941A (ja) 半導体装置の製造方法
JPS6218057A (ja) リ−ドフレ−ム加工方法
JPS5929431A (ja) リ−ド修正方法
JPS5896742A (ja) 半導体素子の接続方法