JPH0445395Y2 - - Google Patents

Info

Publication number

JPH0445395Y2

JPH0445395Y2 JP1986177942U JP17794286U JPH0445395Y2 JP H0445395 Y2 JPH0445395 Y2 JP H0445395Y2 JP 1986177942 U JP1986177942 U JP 1986177942U JP 17794286 U JP17794286 U JP 17794286U JP H0445395 Y2 JPH0445395 Y2 JP H0445395Y2

Authority

JP

Japan

Prior art keywords

grounding

cable

conductive piece

strip

connection body

Prior art date

1986-11-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000010410 layer Substances 0.000 claims description 29
• 239000004020 conductor Substances 0.000 claims description 18
• 239000011241 protective layer Substances 0.000 claims description 12
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
• 230000001681 protective effect Effects 0.000 claims description 3
• 239000011247 coating layer Substances 0.000 description 3
• 238000005452 bending Methods 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 230000015556 catabolic process Effects 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 230000013011 mating Effects 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 239000004033 plastic Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1