JPH0444428B2 - - Google Patents
Info
- Publication number
- JPH0444428B2 JPH0444428B2 JP60030653A JP3065385A JPH0444428B2 JP H0444428 B2 JPH0444428 B2 JP H0444428B2 JP 60030653 A JP60030653 A JP 60030653A JP 3065385 A JP3065385 A JP 3065385A JP H0444428 B2 JPH0444428 B2 JP H0444428B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- substrate
- trench
- capacitor
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 78
- 239000003990 capacitor Substances 0.000 claims description 67
- 238000003860 storage Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 description 19
- 150000004767 nitrides Chemical class 0.000 description 19
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 241000293849 Cordylanthus Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62651284A | 1984-06-29 | 1984-06-29 | |
US626512 | 1984-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6115362A JPS6115362A (ja) | 1986-01-23 |
JPH0444428B2 true JPH0444428B2 (zh) | 1992-07-21 |
Family
ID=24510683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60030653A Granted JPS6115362A (ja) | 1984-06-29 | 1985-02-20 | ダイナミツクramセル |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6115362A (zh) |
CA (1) | CA1228425A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801989A (en) * | 1986-02-20 | 1989-01-31 | Fujitsu Limited | Dynamic random access memory having trench capacitor with polysilicon lined lower electrode |
DE3780840T2 (de) * | 1986-03-03 | 1993-03-25 | Fujitsu Ltd | Einen rillenkondensator enthaltender dynamischer speicher mit wahlfreiem zugriff. |
JPH0691212B2 (ja) * | 1986-10-07 | 1994-11-14 | 日本電気株式会社 | 半導体メモリ |
JP2560307B2 (ja) * | 1987-01-28 | 1996-12-04 | 日本電気株式会社 | 半導体記憶装置及びその製造方法 |
WO2012063393A1 (ja) | 2010-11-10 | 2012-05-18 | 本田技研工業株式会社 | 自動車のフロア構造 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188863A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Field effect type semiconductor device |
JPS5982761A (ja) * | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 半導体メモリ |
JPS59110155A (ja) * | 1982-12-16 | 1984-06-26 | Nec Corp | 半導体メモリセル |
-
1985
- 1985-02-20 JP JP60030653A patent/JPS6115362A/ja active Granted
- 1985-04-09 CA CA000478628A patent/CA1228425A/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188863A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Field effect type semiconductor device |
JPS5982761A (ja) * | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 半導体メモリ |
JPS59110155A (ja) * | 1982-12-16 | 1984-06-26 | Nec Corp | 半導体メモリセル |
Also Published As
Publication number | Publication date |
---|---|
CA1228425A (en) | 1987-10-20 |
JPS6115362A (ja) | 1986-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |