JPH0444323A - 基板の水切り乾燥装置 - Google Patents
基板の水切り乾燥装置Info
- Publication number
- JPH0444323A JPH0444323A JP2152413A JP15241390A JPH0444323A JP H0444323 A JPH0444323 A JP H0444323A JP 2152413 A JP2152413 A JP 2152413A JP 15241390 A JP15241390 A JP 15241390A JP H0444323 A JPH0444323 A JP H0444323A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- water
- tank
- cleaning
- water surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 238000001035 drying Methods 0.000 title claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 82
- 238000004140 cleaning Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 abstract description 11
- 210000000078 claw Anatomy 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003337 fertilizer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2152413A JPH0444323A (ja) | 1990-06-11 | 1990-06-11 | 基板の水切り乾燥装置 |
KR1019910009697A KR930011433B1 (ko) | 1990-06-11 | 1991-06-11 | 기판의 물빼기 건조장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2152413A JPH0444323A (ja) | 1990-06-11 | 1990-06-11 | 基板の水切り乾燥装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0444323A true JPH0444323A (ja) | 1992-02-14 |
Family
ID=15539974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2152413A Pending JPH0444323A (ja) | 1990-06-11 | 1990-06-11 | 基板の水切り乾燥装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0444323A (ko) |
KR (1) | KR930011433B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
WO1997048129A1 (fr) * | 1996-06-14 | 1997-12-18 | Seiko Epson Corporation | Procede de sechage par chauffage et appareil de sechage |
JP2014103149A (ja) * | 2012-11-16 | 2014-06-05 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
-
1990
- 1990-06-11 JP JP2152413A patent/JPH0444323A/ja active Pending
-
1991
- 1991-06-11 KR KR1019910009697A patent/KR930011433B1/ko not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
WO1997048129A1 (fr) * | 1996-06-14 | 1997-12-18 | Seiko Epson Corporation | Procede de sechage par chauffage et appareil de sechage |
US6179930B1 (en) | 1996-06-14 | 2001-01-30 | Seiko Epson Corporation | Pull-up drying method and apparatus |
JP2014103149A (ja) * | 2012-11-16 | 2014-06-05 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
Also Published As
Publication number | Publication date |
---|---|
KR920001642A (ko) | 1992-01-30 |
KR930011433B1 (ko) | 1993-12-06 |
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