JPH0442932Y2 - - Google Patents
Info
- Publication number
- JPH0442932Y2 JPH0442932Y2 JP1986066634U JP6663486U JPH0442932Y2 JP H0442932 Y2 JPH0442932 Y2 JP H0442932Y2 JP 1986066634 U JP1986066634 U JP 1986066634U JP 6663486 U JP6663486 U JP 6663486U JP H0442932 Y2 JPH0442932 Y2 JP H0442932Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass sleeve
- diode
- electrode
- glass
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 51
- 239000008188 pellet Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066634U JPH0442932Y2 (US20030199744A1-20031023-C00003.png) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066634U JPH0442932Y2 (US20030199744A1-20031023-C00003.png) | 1986-04-30 | 1986-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62178540U JPS62178540U (US20030199744A1-20031023-C00003.png) | 1987-11-12 |
JPH0442932Y2 true JPH0442932Y2 (US20030199744A1-20031023-C00003.png) | 1992-10-12 |
Family
ID=30904822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986066634U Expired JPH0442932Y2 (US20030199744A1-20031023-C00003.png) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0442932Y2 (US20030199744A1-20031023-C00003.png) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
-
1986
- 1986-04-30 JP JP1986066634U patent/JPH0442932Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
Also Published As
Publication number | Publication date |
---|---|
JPS62178540U (US20030199744A1-20031023-C00003.png) | 1987-11-12 |
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