JPH0440945B2 - - Google Patents
Info
- Publication number
- JPH0440945B2 JPH0440945B2 JP58196468A JP19646883A JPH0440945B2 JP H0440945 B2 JPH0440945 B2 JP H0440945B2 JP 58196468 A JP58196468 A JP 58196468A JP 19646883 A JP19646883 A JP 19646883A JP H0440945 B2 JPH0440945 B2 JP H0440945B2
- Authority
- JP
- Japan
- Prior art keywords
- rectifier
- semiconductor
- semiconductor rectifier
- disk
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
- H02M7/04—Conversion of AC power input into DC power output without possibility of reversal by static converters
- H02M7/06—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/341—Dispositions of die-attach connectors, e.g. layouts
- H10W72/347—Dispositions of multiple die-attach connectors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58196468A JPS6087675A (ja) | 1983-10-19 | 1983-10-19 | 整流装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58196468A JPS6087675A (ja) | 1983-10-19 | 1983-10-19 | 整流装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6087675A JPS6087675A (ja) | 1985-05-17 |
| JPH0440945B2 true JPH0440945B2 (enExample) | 1992-07-06 |
Family
ID=16358300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58196468A Granted JPS6087675A (ja) | 1983-10-19 | 1983-10-19 | 整流装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6087675A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3426101B2 (ja) * | 1997-02-25 | 2003-07-14 | 三菱電機株式会社 | 整流装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51272A (ja) * | 1974-06-19 | 1976-01-05 | Hitachi Ltd | Denkikairosochioyobisono seiho |
-
1983
- 1983-10-19 JP JP58196468A patent/JPS6087675A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6087675A (ja) | 1985-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4958735B2 (ja) | パワー半導体モジュールの製造方法、パワー半導体モジュールの製造装置、パワー半導体モジュール、及び接合方法 | |
| JPS62194652A (ja) | 半導体装置 | |
| JPH0325022B2 (enExample) | ||
| JPH02138761A (ja) | 半導体装置 | |
| JP2007335663A (ja) | 半導体モジュール | |
| JPS59130449A (ja) | 絶縁型半導体素子用リードフレーム | |
| JPS6149446A (ja) | 樹脂封止型半導体装置 | |
| JPH11121662A (ja) | 半導体装置の冷却構造 | |
| JPH04291750A (ja) | 放熱フィンおよび半導体集積回路装置 | |
| JP3193142B2 (ja) | 基 板 | |
| JPS6020538A (ja) | 半導体装置 | |
| JPS6087675A (ja) | 整流装置 | |
| JPS627145A (ja) | 電力半導体装置 | |
| JPH01132146A (ja) | 半導体装置 | |
| JP2690248B2 (ja) | 表面実装型半導体装置 | |
| JPS64814B2 (enExample) | ||
| JPS6244541Y2 (enExample) | ||
| TW202343719A (zh) | 離散功率半導體封裝 | |
| JPS6233331Y2 (enExample) | ||
| JPH0648863Y2 (ja) | 集積回路の冷却構造 | |
| JPH0534829B2 (enExample) | ||
| JPS61125057A (ja) | 半導体装置 | |
| JPS63169749A (ja) | 半導体装置 | |
| JPS60241240A (ja) | 半導体装置 | |
| JPS5965458A (ja) | 半導体装置の製造方法 |