JPS64814B2 - - Google Patents

Info

Publication number
JPS64814B2
JPS64814B2 JP58196467A JP19646783A JPS64814B2 JP S64814 B2 JPS64814 B2 JP S64814B2 JP 58196467 A JP58196467 A JP 58196467A JP 19646783 A JP19646783 A JP 19646783A JP S64814 B2 JPS64814 B2 JP S64814B2
Authority
JP
Japan
Prior art keywords
rectifier
semiconductor rectifier
disk
cooling fin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58196467A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6088449A (ja
Inventor
Mitsutoshi Horibe
Tadashi Nosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP58196467A priority Critical patent/JPS6088449A/ja
Publication of JPS6088449A publication Critical patent/JPS6088449A/ja
Publication of JPS64814B2 publication Critical patent/JPS64814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP58196467A 1983-10-19 1983-10-19 整流装置 Granted JPS6088449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58196467A JPS6088449A (ja) 1983-10-19 1983-10-19 整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58196467A JPS6088449A (ja) 1983-10-19 1983-10-19 整流装置

Publications (2)

Publication Number Publication Date
JPS6088449A JPS6088449A (ja) 1985-05-18
JPS64814B2 true JPS64814B2 (enExample) 1989-01-09

Family

ID=16358283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58196467A Granted JPS6088449A (ja) 1983-10-19 1983-10-19 整流装置

Country Status (1)

Country Link
JP (1) JPS6088449A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220007348A (ko) * 2020-07-10 2022-01-18 주식회사 엘지에너지솔루션 배터리 모니터링 장치 및 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220007348A (ko) * 2020-07-10 2022-01-18 주식회사 엘지에너지솔루션 배터리 모니터링 장치 및 방법

Also Published As

Publication number Publication date
JPS6088449A (ja) 1985-05-18

Similar Documents

Publication Publication Date Title
JP4958735B2 (ja) パワー半導体モジュールの製造方法、パワー半導体モジュールの製造装置、パワー半導体モジュール、及び接合方法
JP2003264265A (ja) 電力用半導体装置
JP5975909B2 (ja) 半導体装置
JP6777148B2 (ja) 半導体装置
JP7023339B1 (ja) 半導体装置
JP2569008B2 (ja) 半導体装置
JP2950468B2 (ja) 半導体装置
JPS60137041A (ja) 樹脂封止形半導体装置
JP3250635B2 (ja) 半導体装置
JPS6088449A (ja) 整流装置
JPS6259888B2 (enExample)
JPS627145A (ja) 電力半導体装置
JPH0534829B2 (enExample)
JP2009224556A (ja) 印刷版及びそれを用いたパワーモジュールの組み付け方法
JPH08186199A (ja) 樹脂封止型半導体装置
JPH0440945B2 (enExample)
JP2575836Y2 (ja) 半導体装置
JP3171330B2 (ja) 半導体装置
JPS61265849A (ja) 電力半導体装置
JPS6244541Y2 (enExample)
JP2796401B2 (ja) 半導体集積回路装置
JPS6218048Y2 (enExample)
JPS6233331Y2 (enExample)
JP2010010503A (ja) 半導体装置
JP2619155B2 (ja) 混成集積回路装置