JPH0440279Y2 - - Google Patents
Info
- Publication number
- JPH0440279Y2 JPH0440279Y2 JP1986004213U JP421386U JPH0440279Y2 JP H0440279 Y2 JPH0440279 Y2 JP H0440279Y2 JP 1986004213 U JP1986004213 U JP 1986004213U JP 421386 U JP421386 U JP 421386U JP H0440279 Y2 JPH0440279 Y2 JP H0440279Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cut
- cap
- view
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Closures For Containers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004213U JPH0440279Y2 (enEXAMPLES) | 1986-01-14 | 1986-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004213U JPH0440279Y2 (enEXAMPLES) | 1986-01-14 | 1986-01-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6316454U JPS6316454U (enEXAMPLES) | 1988-02-03 |
| JPH0440279Y2 true JPH0440279Y2 (enEXAMPLES) | 1992-09-21 |
Family
ID=30784677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986004213U Expired JPH0440279Y2 (enEXAMPLES) | 1986-01-14 | 1986-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440279Y2 (enEXAMPLES) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621350A (en) * | 1979-07-31 | 1981-02-27 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS58191645U (ja) * | 1982-06-15 | 1983-12-20 | 三菱電機株式会社 | 半導体装置のパツケ−ジ |
| JPH0343699A (ja) * | 1989-07-06 | 1991-02-25 | Daikin Ind Ltd | ファンの周期性騒音の消音装置 |
-
1986
- 1986-01-14 JP JP1986004213U patent/JPH0440279Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6316454U (enEXAMPLES) | 1988-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0440279Y2 (enEXAMPLES) | ||
| JPH0461502B2 (enEXAMPLES) | ||
| JPS6232622A (ja) | 半導体装置用樹脂封止金型 | |
| JP2564104Y2 (ja) | 半導体装置封止用キヤツプ | |
| JPH0543558U (ja) | 固体撮像装置 | |
| JPS58163919A (ja) | 液晶セルの製造方法 | |
| JPS6040704B2 (ja) | 半導体装置のパツケ−ジ | |
| JPH0360057A (ja) | 半導体装置 | |
| JPH05326730A (ja) | 固体撮像素子のシール方法 | |
| JPH0451144U (enEXAMPLES) | ||
| JPH02131344U (enEXAMPLES) | ||
| JPS6235544A (ja) | 樹脂封止形半導体装置 | |
| JPH05326731A (ja) | 固体撮像装置 | |
| JPH1126680A (ja) | 半導体装置用リードフレーム | |
| JPH0233451U (enEXAMPLES) | ||
| JPH0528047U (ja) | 半導体パツケージ | |
| JPH0434769U (enEXAMPLES) | ||
| JPS63275148A (ja) | ピングリッドアレイ半導体モジュ−ル | |
| JPS6219754U (enEXAMPLES) | ||
| JPH0485737U (enEXAMPLES) | ||
| JPH0669381A (ja) | 半導体集積回路装置 | |
| JPH0396045U (enEXAMPLES) | ||
| JPS6235545A (ja) | 樹脂封止半導体装置 | |
| JPH0354839B2 (enEXAMPLES) | ||
| JPH0330430U (enEXAMPLES) |