JPH0440278Y2 - - Google Patents
Info
- Publication number
- JPH0440278Y2 JPH0440278Y2 JP7037485U JP7037485U JPH0440278Y2 JP H0440278 Y2 JPH0440278 Y2 JP H0440278Y2 JP 7037485 U JP7037485 U JP 7037485U JP 7037485 U JP7037485 U JP 7037485U JP H0440278 Y2 JPH0440278 Y2 JP H0440278Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- electrodes
- semiconductor chip
- stage
- lens group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000007689 inspection Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7037485U JPH0440278Y2 (show.php) | 1985-05-13 | 1985-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7037485U JPH0440278Y2 (show.php) | 1985-05-13 | 1985-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186237U JPS61186237U (show.php) | 1986-11-20 |
| JPH0440278Y2 true JPH0440278Y2 (show.php) | 1992-09-21 |
Family
ID=30606894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7037485U Expired JPH0440278Y2 (show.php) | 1985-05-13 | 1985-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440278Y2 (show.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5288411B2 (ja) * | 2009-09-24 | 2013-09-11 | ボンドテック株式会社 | アライメント装置 |
-
1985
- 1985-05-13 JP JP7037485U patent/JPH0440278Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61186237U (show.php) | 1986-11-20 |
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