JPH0439230B2 - - Google Patents

Info

Publication number
JPH0439230B2
JPH0439230B2 JP57061957A JP6195782A JPH0439230B2 JP H0439230 B2 JPH0439230 B2 JP H0439230B2 JP 57061957 A JP57061957 A JP 57061957A JP 6195782 A JP6195782 A JP 6195782A JP H0439230 B2 JPH0439230 B2 JP H0439230B2
Authority
JP
Japan
Prior art keywords
semiconductor device
outer lead
silicone rubber
resin
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57061957A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58178541A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57061957A priority Critical patent/JPS58178541A/ja
Publication of JPS58178541A publication Critical patent/JPS58178541A/ja
Publication of JPH0439230B2 publication Critical patent/JPH0439230B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57061957A 1982-04-14 1982-04-14 半導体装置 Granted JPS58178541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57061957A JPS58178541A (ja) 1982-04-14 1982-04-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57061957A JPS58178541A (ja) 1982-04-14 1982-04-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58178541A JPS58178541A (ja) 1983-10-19
JPH0439230B2 true JPH0439230B2 (de) 1992-06-26

Family

ID=13186174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57061957A Granted JPS58178541A (ja) 1982-04-14 1982-04-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58178541A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605506B2 (ja) * 1991-07-10 1997-04-30 三菱電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858352B2 (ja) * 1978-12-12 1983-12-24 イスチツト．ルソフアルマコ．デイ．イタリアイス．ピ−．エ− 置換２−フエニルアミノイミダゾリン−（２）誘導体及びその製造法並びにその薬学的組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858352U (ja) * 1981-10-16 1983-04-20 日本電気株式会社 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858352B2 (ja) * 1978-12-12 1983-12-24 イスチツト．ルソフアルマコ．デイ．イタリアイス．ピ−．エ− 置換２−フエニルアミノイミダゾリン−（２）誘導体及びその製造法並びにその薬学的組成物

Also Published As

Publication number Publication date
JPS58178541A (ja) 1983-10-19

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