JPH04369290A - 保護フィルム付き両面粗化処理銅箔及びその製法 - Google Patents
保護フィルム付き両面粗化処理銅箔及びその製法Info
- Publication number
- JPH04369290A JPH04369290A JP3145704A JP14570491A JPH04369290A JP H04369290 A JPH04369290 A JP H04369290A JP 3145704 A JP3145704 A JP 3145704A JP 14570491 A JP14570491 A JP 14570491A JP H04369290 A JPH04369290 A JP H04369290A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- protective film
- double
- foil
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 239000011889 copper foil Substances 0.000 title claims abstract description 64
- 230000001681 protective effect Effects 0.000 title claims abstract description 34
- 239000011888 foil Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 9
- 238000003475 lamination Methods 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- 238000003825 pressing Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- PTZYLNQTMGLYHH-UHFFFAOYSA-N 1,1-diphenylpent-1-en-2-ylbenzene Chemical compound C=1C=CC=CC=1C(CCC)=C(C=1C=CC=CC=1)C1=CC=CC=C1 PTZYLNQTMGLYHH-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145704A JPH04369290A (ja) | 1991-06-18 | 1991-06-18 | 保護フィルム付き両面粗化処理銅箔及びその製法 |
| KR1019920009665A KR100324486B1 (ko) | 1991-06-18 | 1992-06-04 | 보호필름이부착된양면조화동박 |
| DE69225091T DE69225091T2 (de) | 1991-06-18 | 1992-06-08 | Beidseitig aufgerauhte Kupferfolie mit Schutzfilm |
| EP92305243A EP0519631B1 (en) | 1991-06-18 | 1992-06-08 | Both-side roughened copper foil with protection film |
| TW081104483A TW210421B (US06373033-20020416-M00002.png) | 1991-06-18 | 1992-06-09 | |
| US08/111,018 US5413838A (en) | 1991-06-18 | 1993-08-24 | Both-side roughened copper foil with protection film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145704A JPH04369290A (ja) | 1991-06-18 | 1991-06-18 | 保護フィルム付き両面粗化処理銅箔及びその製法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04369290A true JPH04369290A (ja) | 1992-12-22 |
Family
ID=15391189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3145704A Pending JPH04369290A (ja) | 1991-06-18 | 1991-06-18 | 保護フィルム付き両面粗化処理銅箔及びその製法 |
Country Status (5)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005340382A (ja) * | 2004-05-25 | 2005-12-08 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法 |
| WO2007091807A1 (en) * | 2006-02-06 | 2007-08-16 | Lg Chem, Ltd. | Copper clad laminate for chip on film |
| JP2008251970A (ja) * | 2007-03-30 | 2008-10-16 | Ajinomoto Co Inc | 多層プリント配線板の製造法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770380B2 (en) | 1998-08-11 | 2004-08-03 | Nikko Materials Usa, Inc. | Resin/copper/metal laminate and method of producing same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1778825A1 (de) * | 1968-06-10 | 1971-08-26 | Licentia Gmbh | Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen |
| EP0395871A3 (en) * | 1989-05-05 | 1991-09-18 | Gould Electronics Inc. | Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing |
| JPH0366195A (ja) * | 1989-08-04 | 1991-03-20 | Hitachi Chem Co Ltd | 銅張り積層板 |
-
1991
- 1991-06-18 JP JP3145704A patent/JPH04369290A/ja active Pending
-
1992
- 1992-06-04 KR KR1019920009665A patent/KR100324486B1/ko not_active IP Right Cessation
- 1992-06-08 DE DE69225091T patent/DE69225091T2/de not_active Expired - Fee Related
- 1992-06-08 EP EP92305243A patent/EP0519631B1/en not_active Expired - Lifetime
- 1992-06-09 TW TW081104483A patent/TW210421B/zh active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005340382A (ja) * | 2004-05-25 | 2005-12-08 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法 |
| WO2007091807A1 (en) * | 2006-02-06 | 2007-08-16 | Lg Chem, Ltd. | Copper clad laminate for chip on film |
| JP2008251970A (ja) * | 2007-03-30 | 2008-10-16 | Ajinomoto Co Inc | 多層プリント配線板の製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69225091T2 (de) | 1998-12-03 |
| DE69225091D1 (de) | 1998-05-20 |
| TW210421B (US06373033-20020416-M00002.png) | 1993-08-01 |
| KR930000257A (ko) | 1993-01-15 |
| KR100324486B1 (ko) | 2002-06-20 |
| EP0519631B1 (en) | 1998-04-15 |
| EP0519631A3 (US06373033-20020416-M00002.png) | 1994-12-28 |
| EP0519631A2 (en) | 1992-12-23 |
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