KR930000257A - 보호필름이 부착된 양면조화동박 - Google Patents

보호필름이 부착된 양면조화동박 Download PDF

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Publication number
KR930000257A
KR930000257A KR1019920009665A KR920009665A KR930000257A KR 930000257 A KR930000257 A KR 930000257A KR 1019920009665 A KR1019920009665 A KR 1019920009665A KR 920009665 A KR920009665 A KR 920009665A KR 930000257 A KR930000257 A KR 930000257A
Authority
KR
South Korea
Prior art keywords
copper foil
protective film
double
foil
sided
Prior art date
Application number
KR1019920009665A
Other languages
English (en)
Other versions
KR100324486B1 (ko
Inventor
기미가쥬 가토
게이지 아주마
료이치 오구로
Original Assignee
노무라 마사
스미토모 베크라이트 가부시끼가이샤
히라사 가추요시
후루카와 서키트 호일 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노무라 마사, 스미토모 베크라이트 가부시끼가이샤, 히라사 가추요시, 후루카와 서키트 호일 가부시끼가이샤 filed Critical 노무라 마사
Publication of KR930000257A publication Critical patent/KR930000257A/ko
Application granted granted Critical
Publication of KR100324486B1 publication Critical patent/KR100324486B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

내용 없음

Description

보호필름이 부착된 양면조화동박
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 적층용 양면조화처리동박의 한면에, 금속박 또는 융점이 적층온도 이상인 유기계 필름을 적층하고, 상기 양면조화처리동박과 금속박 또는 유기계 필름을 한쪽 모서리 또는 양쪽 모서리에 연속 또는 단속적으로 접착 또는 점착시킨 보호 필름부착 양면조화동박.
  2. 제1항에 있어서, 금속박이 전해동박, 압연동박 또는 알루미늄박이며, 유기계 필름이 융점이 170℃ 이상인 폴리아미드계 수지 필림인 보호필름 부착 양면조화동박.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920009665A 1991-06-18 1992-06-04 보호필름이부착된양면조화동박 KR100324486B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-145704 1991-06-18
JP3145704A JPH04369290A (ja) 1991-06-18 1991-06-18 保護フィルム付き両面粗化処理銅箔及びその製法

Publications (2)

Publication Number Publication Date
KR930000257A true KR930000257A (ko) 1993-01-15
KR100324486B1 KR100324486B1 (ko) 2002-06-20

Family

ID=15391189

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920009665A KR100324486B1 (ko) 1991-06-18 1992-06-04 보호필름이부착된양면조화동박

Country Status (5)

Country Link
EP (1) EP0519631B1 (ko)
JP (1) JPH04369290A (ko)
KR (1) KR100324486B1 (ko)
DE (1) DE69225091T2 (ko)
TW (1) TW210421B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770380B2 (en) 1998-08-11 2004-08-03 Nikko Materials Usa, Inc. Resin/copper/metal laminate and method of producing same
JP2005340382A (ja) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
JP5018181B2 (ja) * 2007-03-30 2012-09-05 味の素株式会社 多層プリント配線板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1778825A1 (de) * 1968-06-10 1971-08-26 Licentia Gmbh Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
JPH0366195A (ja) * 1989-08-04 1991-03-20 Hitachi Chem Co Ltd 銅張り積層板

Also Published As

Publication number Publication date
DE69225091T2 (de) 1998-12-03
DE69225091D1 (de) 1998-05-20
TW210421B (ko) 1993-08-01
KR100324486B1 (ko) 2002-06-20
EP0519631B1 (en) 1998-04-15
EP0519631A3 (ko) 1994-12-28
JPH04369290A (ja) 1992-12-22
EP0519631A2 (en) 1992-12-23

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