KR880002415A - 배선 기판과 이를 사용한 서말 프린팅 헤드 - Google Patents

배선 기판과 이를 사용한 서말 프린팅 헤드 Download PDF

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Publication number
KR880002415A
KR880002415A KR1019870007289A KR870007289A KR880002415A KR 880002415 A KR880002415 A KR 880002415A KR 1019870007289 A KR1019870007289 A KR 1019870007289A KR 870007289 A KR870007289 A KR 870007289A KR 880002415 A KR880002415 A KR 880002415A
Authority
KR
South Korea
Prior art keywords
thermal printing
mol
wiring boards
printing heads
alloy
Prior art date
Application number
KR1019870007289A
Other languages
English (en)
Other versions
KR900003849B1 (ko
Inventor
야스노리 나리즈가
게이지 모리
아기라 야부시다
시네아기 가메이
마모루 모리다
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61161823A external-priority patent/JPH0783172B2/ja
Priority claimed from JP61171537A external-priority patent/JPS6328665A/ja
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR880002415A publication Critical patent/KR880002415A/ko
Application granted granted Critical
Publication of KR900003849B1 publication Critical patent/KR900003849B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3352—Integrated circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33575—Processes for assembling process heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81399—Material
    • H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/81438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/81455—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81399—Material
    • H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/81463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/81471—Chromium [Cr] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electronic Switches (AREA)

Abstract

내용 없음

Description

배선 기판과 이를 사용한 서말 프린팅 헤드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명에 의한 Ni-Cu 합금 조성비를 나타낸 Cu-Ni 합금의 평형 상태의 도면.
제 2 도는 본 발명의 1실시예에 있어서 Ni-Cu 합금막의 형성 조건을 나타낸 도면.
제 4a 도 및 제 4b 도는 본 발명의 1실시예에 있어서 서말 프린팅 헤드의 구조 단면도.

Claims (2)

  1. 요구하는 배선을 갖는 배선 기판에 있어서, 납땜을 하는 전극의 일부 또는 전부가 Ni와 Cu의 합금으로 조성되고, 그 조성이 65mol%Ni-35mol%Cu에서 75mol%Ni-25mol%Cu까지의 범위내인 합금인 것을 특징으로 하는 배선기판.
  2. 요구하는 배선을 갖는 서말 프린팅 헤드에 있어서, 납땜을 하는 부분이 Ni와 Cu의 합금으로 조성되고, 그 조성이 65mol%Ni-35mol%Cu에서 75mol%Ni-25mol%Cu까지의 범위내인 합금인 것을 특징으로하는 서말 프링팅 헤드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870007289A 1986-07-11 1987-07-08 배선 기판과 이를 사용한 서말 프린팅 헤드 KR900003849B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP86-161823 1986-07-11
JP61161823A JPH0783172B2 (ja) 1986-07-11 1986-07-11 配線基板
JP161823 1986-07-11
JP171537 1986-07-23
JP61171537A JPS6328665A (ja) 1986-07-23 1986-07-23 サ−マルヘツドとその製造方法
JP86-171537 1986-07-23

Publications (2)

Publication Number Publication Date
KR880002415A true KR880002415A (ko) 1988-04-30
KR900003849B1 KR900003849B1 (ko) 1990-06-02

Family

ID=26487807

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007289A KR900003849B1 (ko) 1986-07-11 1987-07-08 배선 기판과 이를 사용한 서말 프린팅 헤드

Country Status (2)

Country Link
US (1) US4806725A (ko)
KR (1) KR900003849B1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2839600B2 (ja) * 1989-12-20 1998-12-16 株式会社日立製作所 サーマル・ヘッド及びその製造方法
JP3198661B2 (ja) * 1992-10-14 2001-08-13 株式会社村田製作所 誘電体共振器装置およびその実装構造
DE19735760A1 (de) * 1997-08-18 1999-02-25 Zeiss Carl Fa Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen
JP3868854B2 (ja) * 2002-06-14 2007-01-17 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体およびその製造方法
JP2004300467A (ja) * 2003-03-28 2004-10-28 Alps Electric Co Ltd 金属体の表面構造
US7413670B2 (en) * 2004-06-25 2008-08-19 Mutual-Pak Technology Co., Ltd. Method for forming wiring on a substrate
US20090174052A1 (en) * 2006-05-29 2009-07-09 Nec Corporation Electronic component, semiconductor package, and electronic device
US8320083B1 (en) * 2007-12-06 2012-11-27 Magnecomp Corporation Electrical interconnect with improved corrosion resistance for a disk drive head suspension
EP2640172A1 (en) * 2010-11-12 2013-09-18 JX Nippon Mining & Metals Corporation Method for forming circuit on flexible laminate substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2150094A (en) * 1935-02-21 1939-03-07 Int Nickel Co Treatment of nickel and nickel alloys and products resulting therefrom
US2090946A (en) * 1936-10-16 1937-08-24 Eisler Electric Corp Alloy metal
US2234955A (en) * 1939-01-28 1941-03-18 Int Nickel Co Nickel alloys and process of treating the same
US3282689A (en) * 1963-07-03 1966-11-01 Allis Chalmers Mfg Co Welding wire consisting of nickeltitanium-carbon-silicon-copper
US4195937A (en) * 1977-09-19 1980-04-01 Termcom, Inc. Electroresistive printing apparatus

Also Published As

Publication number Publication date
KR900003849B1 (ko) 1990-06-02
US4806725A (en) 1989-02-21

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