KR970072353A - 복합 필름 및 복합 필름이 부착된 리드 프레임 - Google Patents

복합 필름 및 복합 필름이 부착된 리드 프레임 Download PDF

Info

Publication number
KR970072353A
KR970072353A KR1019970014252A KR19970014252A KR970072353A KR 970072353 A KR970072353 A KR 970072353A KR 1019970014252 A KR1019970014252 A KR 1019970014252A KR 19970014252 A KR19970014252 A KR 19970014252A KR 970072353 A KR970072353 A KR 970072353A
Authority
KR
South Korea
Prior art keywords
composite film
film
adhesive layer
base film
thickness
Prior art date
Application number
KR1019970014252A
Other languages
English (en)
Other versions
KR100241567B1 (ko
Inventor
히데까즈 마쓰우라
요시히로 노무라
Original Assignee
단노 다께시
히다찌 가세이 고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 단노 다께시, 히다찌 가세이 고오교 가부시끼가이샤 filed Critical 단노 다께시
Publication of KR970072353A publication Critical patent/KR970072353A/ko
Application granted granted Critical
Publication of KR100241567B1 publication Critical patent/KR100241567B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether
    • C09J2471/006—Presence of polyether in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2481/00—Presence of sulfur containing polymers
    • C09J2481/006—Presence of sulfur containing polymers in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)

Abstract

베이스 필름 및 베이스 필름의 하나 이상의 측면 상에 있는 접착제 층을 포함하는 복합 필름에 있어서, 복합필름은 두께T(㎛) 를 가지며, 베이스 필름은 R (kg/20mm)의 모서리 인열 강도를 갖고, 접착제 층은 총 두께 A를 가지며, 베이스 필름은 두께 B를 갖고, T는 R에 대하여 관계식 R0.6T-8 (T≤60 일 때), 또는 관계식 R≥28 (T60 일때)을 가지며, A/B는 0.5 내지 1.4인 복합필름.

Description

복합 필름 및 복합 필름이 부착된 리드 프레임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 베이스 필름 및 베이스 필름의 하나 이상의 측면 상에 있는 접착제 층을 포함하는 복합 필름에 있어서, 복합 필름은 두께 T(㎛)를 가지며, 베이스 필름은 R (kg/20mm)의 모서리 인열 강도를 갖고, 접착제 층은 총 두께 A를 가지며, 베이스 필름은 두께 B를 갖고, T는 R에 대하여 관계식 R〉0.6T-8 (T≤60 일 때), 또는 관계식 R≥28 (T〉60 일때)을 가지며, A/B는 0.5 내지 1.4인 복합필름.
  2. 제1항에 있어서, 접척제 층이 150 내지 350℃의 유리 전이 온도, 3중량% 이하이 흡수율 및 2mm 이하의 확장 길이를 갖는 내열성 접착제로 만들어진 복합 필름.
  3. 제1항에 있어서, 접착제 층이 150 내지 350℃ 내지 유리 전이 온도, 3중량% 이하의 흡수율을 갖는 내열성 접착제 층이고, 베이스 필름은 200℃ 이상의 유리 전이 온도 및 3중량% 이하의 흡수율을 갖는 내열성 필름이며, 베이스 필름의 유리 전이 온도는 내열성 접착제의 유리 전이 온도보다 높은 복합 필름.
  4. 제 3항에 있어서, 내열성 접착제가 2mm 이하의 확장 길이를 갖는 복합 필름.
  5. 제4항에 있어서, 접척제가 폴리이미드 접착제 또는 폴리아미드 접착제인 복합 필름.
  6. 제4항에 있어서, 베이스 필름이 폴리이미드, 폴리아미드, 폴리술폰, 폴리페닐렌술피드, 폴리에테르에테 르케톤 및 폴리아릴레이트로 이루어진 군으로부터 선택된 수지로 만들어진 내열성 필름인 복합 필름.
  7. 제1항에 있어서, 베이스 필름의 각 측면이 접착제 층으로 도포되고 두께 A는 접착제 층의 총 두께인 복합필름.
  8. 제1항에 있어서, 베이스 필름은 5 내지 150㎛의 두께를 가지며 각 접착제 층은 5 내지 50㎛의 두께를 갖는 복합필름.
  9. 리드 프레임 본체 및 리드 프레임 본체에 도포된 복합 필름을 포함하며, 복합 필름은 제1항의 복합 필름으로부터 펀칭된, 복합 필름이 부착된 리드 프레임.
  10. 제9항에 있어서, 리드 프레임 본체 및 복합 필름이, 복합 필름의 한 접착제 층에 의하여 서로 접착된 리드 프레임.
    ※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR1019970014252A 1996-04-19 1997-04-17 복합 필름 및 복합 필름이 부착된 리드 프레임 KR100241567B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9802796 1996-04-19
JP96-98027 1996-04-19

Publications (2)

Publication Number Publication Date
KR970072353A true KR970072353A (ko) 1997-11-07
KR100241567B1 KR100241567B1 (ko) 2000-02-01

Family

ID=14208472

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970014252A KR100241567B1 (ko) 1996-04-19 1997-04-17 복합 필름 및 복합 필름이 부착된 리드 프레임

Country Status (3)

Country Link
US (3) US5998020A (ko)
KR (1) KR100241567B1 (ko)
TW (1) TW326566B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW326566B (en) * 1996-04-19 1998-02-11 Hitachi Chemical Co Ltd Composite film and lead frame with composite film attached
US6700185B1 (en) * 1999-11-10 2004-03-02 Hitachi Chemical Co., Ltd. Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device
EP1589086A4 (en) * 2003-01-31 2006-03-22 Teijin Ltd ADHESIVE SHEET AND LAYERED PRODUCT
CN1311039C (zh) * 2003-01-31 2007-04-18 帝人株式会社 粘合片材和层合体
CA2551542A1 (en) * 2003-12-24 2005-07-07 Teijin Limited Laminate
US20060275589A1 (en) * 2005-05-20 2006-12-07 Hollingbery David P Film and process
US9909783B2 (en) 2010-02-23 2018-03-06 Robert Jensen Twisted conduit for geothermal heat exchange
US9109813B2 (en) * 2010-02-23 2015-08-18 Robert Jensen Twisted conduit for geothermal heating and cooling systems
US20110203765A1 (en) * 2010-02-23 2011-08-25 Robert Jensen Multipipe conduit for geothermal heating and cooling systems

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4289568A (en) * 1979-06-04 1981-09-15 Arnold Engineering Company Apparatus for automated application of heat sensitive tape
JPS6038825A (ja) * 1983-08-11 1985-02-28 Sumitomo Metal Mining Co Ltd テ−プ貼着装置
JPH01299884A (ja) * 1988-05-28 1989-12-04 Tomoegawa Paper Co Ltd ダイボンディング接着テープ
JP2547823B2 (ja) 1988-07-26 1996-10-23 株式会社日立製作所 半導体装置及びその製造方法
US5277972B1 (en) * 1988-09-29 1996-11-05 Tomoegawa Paper Co Ltd Adhesive tapes
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
JP2603543B2 (ja) 1989-08-03 1997-04-23 株式会社 巴川製紙所 電子部品用接着テープ
JPH0760919B2 (ja) 1990-04-24 1995-06-28 東レ株式会社 フレキシブルプリント配線板
JP2895920B2 (ja) 1990-06-11 1999-05-31 株式会社日立製作所 半導体装置及びその製造方法
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
JP2732020B2 (ja) * 1993-10-22 1998-03-25 株式会社巴川製紙所 電子部品用接着テープおよび液状接着剤
CN1041034C (zh) * 1993-03-29 1998-12-02 日立化成工业株式会社 半导体组件的制造方法
US6372080B1 (en) * 1993-03-29 2002-04-16 Hitachi Chemical Company, Ltd Process for fabricating a crack resistant resin encapsulated semiconductor chip package
JP3109707B2 (ja) 1993-03-29 2000-11-20 日立化成工業株式会社 耐熱性接着剤及びそれを含む半導体パッケージ
US5507910A (en) * 1993-04-28 1996-04-16 Apic Yamada Corporation Lead frame taping machine
GB2277894B (en) * 1993-05-14 1996-04-03 Hitachi Cable Method and apparatus for sticking an insulating film to a lead frame
JP2923170B2 (ja) 1993-05-26 1999-07-26 日立電線株式会社 打抜き性に優れたフィルム及びこれを用いたリードフレーム
JP2820645B2 (ja) * 1994-08-30 1998-11-05 アナム インダストリアル カンパニー インコーポレーティド 半導体リードフレーム
TW315491B (en) * 1995-07-31 1997-09-11 Micron Technology Inc Apparatus for applying adhesive tape for semiconductor packages
JP2992462B2 (ja) * 1995-08-31 1999-12-20 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
TW326566B (en) * 1996-04-19 1998-02-11 Hitachi Chemical Co Ltd Composite film and lead frame with composite film attached
US6252033B1 (en) * 2000-03-20 2001-06-26 Saehan Industries Incorporation Method for the preparation of polyamic acid and polymide useful for adhesives

Also Published As

Publication number Publication date
US6302991B1 (en) 2001-10-16
US20020007905A1 (en) 2002-01-24
KR100241567B1 (ko) 2000-02-01
US5998020A (en) 1999-12-07
US6558500B2 (en) 2003-05-06
TW326566B (en) 1998-02-11

Similar Documents

Publication Publication Date Title
KR970059778A (ko) 광학막 및 액정 표시 장치
BR9811965A (pt) Laminados elásticos e métodos para prepará-los
MX165519B (es) Un laminado de un polimero resistente al desgaste
MXPA02004173A (es) Construcciones compuestas de psa de multiples capas.
TR200001130A2 (tr) Sugeçirmez fermuar ve fermuarın imalat yöntemi
KR970072353A (ko) 복합 필름 및 복합 필름이 부착된 리드 프레임
BR9610068A (pt) Estrutura de laminado aperfeiçoada e processo para a sua produção.
KR880010343A (ko) 광파래더를 구비한 도관
FR2844742B1 (fr) Feuilles composites stratifiees aluminium-fibres de verre
BR9806810A (pt) Métodos para produção de uma estrutura laminada para uso em um filamento ou fita de segurança e para produção de um substrato de segurança para uso em um documento de segurança filamento ou fita de segurança, e, nota de banco.
BR0009736A (pt) Adesivo sensìvel a pressão, processo de preparação de adesivo sensìvel à pressão, laminado, e, emulsão aquosa de látex
DE60214395D1 (de) Leitfähiges verbundmaterial
ATE222851T1 (de) Hochtemperatur-trennfilme
KR960017556A (ko) 방화안전유리
DK1298627T3 (da) Etiketlaminat
KR970020147A (ko) 필터
DE69513033D1 (de) Wiederaufarbeitbare druckempfindliche klebkonstruktionen mit mehreren schichten
FR2625242B1 (fr) Feuille d'etancheite pour toitures
ATE227252T1 (de) Oxidations- und korrosionsbeständiger, flexibler graphitkompositfilm und verfahren
ATE95857T1 (de) Bitumoese dichtungsbahn.
KR970000545A (ko) 발포 폴리에틸렌 벽지
AU2002313750A1 (en) Glazing prelaminates, glazing laminates, and methods of making same
BR9801974A (pt) Fita de reforço para fecho corrediço e metodo para reforcar secoes terminais da fita de reforco.
ATE263878T1 (de) Isolierendes dacheindeckungselement
BR0105691A (pt) Fita de reforço para fecho deslizante

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20121026

Year of fee payment: 14

FPAY Annual fee payment

Payment date: 20131025

Year of fee payment: 15

FPAY Annual fee payment

Payment date: 20141024

Year of fee payment: 16

LAPS Lapse due to unpaid annual fee