JPH0436797B2 - - Google Patents

Info

Publication number
JPH0436797B2
JPH0436797B2 JP59168425A JP16842584A JPH0436797B2 JP H0436797 B2 JPH0436797 B2 JP H0436797B2 JP 59168425 A JP59168425 A JP 59168425A JP 16842584 A JP16842584 A JP 16842584A JP H0436797 B2 JPH0436797 B2 JP H0436797B2
Authority
JP
Japan
Prior art keywords
external lead
lead terminals
brazing
brazing material
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59168425A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6146392A (ja
Inventor
Yoshihiro Hosoi
Minobu Kunitomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP16842584A priority Critical patent/JPS6146392A/ja
Publication of JPS6146392A publication Critical patent/JPS6146392A/ja
Publication of JPH0436797B2 publication Critical patent/JPH0436797B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16842584A 1984-08-10 1984-08-10 電子部品における外部リード端子のロウ付け用材料 Granted JPS6146392A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16842584A JPS6146392A (ja) 1984-08-10 1984-08-10 電子部品における外部リード端子のロウ付け用材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16842584A JPS6146392A (ja) 1984-08-10 1984-08-10 電子部品における外部リード端子のロウ付け用材料

Publications (2)

Publication Number Publication Date
JPS6146392A JPS6146392A (ja) 1986-03-06
JPH0436797B2 true JPH0436797B2 (enrdf_load_stackoverflow) 1992-06-17

Family

ID=15867881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16842584A Granted JPS6146392A (ja) 1984-08-10 1984-08-10 電子部品における外部リード端子のロウ付け用材料

Country Status (1)

Country Link
JP (1) JPS6146392A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2438198A (en) * 2006-05-16 2007-11-21 Andrew Hermiston Hooper Silver alloys

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745462A (en) * 1980-09-03 1982-03-15 Jeco Co Ltd Tachometer
EP0066434B1 (en) * 1981-06-03 1985-08-07 National Nuclear Corporation Limited Determination of heat transfer from a surface

Also Published As

Publication number Publication date
JPS6146392A (ja) 1986-03-06

Similar Documents

Publication Publication Date Title
KR100309229B1 (ko) 납석출 땜납과 납땜된 물품
JPH0653594B2 (ja) 導体組成物
US5928568A (en) Thick film circuit having conductor composition with coated metallic particles
JPH0436796B2 (enrdf_load_stackoverflow)
US5716552A (en) Thick-film conductor compostions comprising silver or palladium particles coated with alumina or zirconia
JPH0436797B2 (enrdf_load_stackoverflow)
JPH0514363B2 (enrdf_load_stackoverflow)
JP2550630B2 (ja) 導電性被膜形成用銅ペースト
JP2627532B2 (ja) ロウ付け用材料
JPH06342965A (ja) セラミックス回路基板及びその製造方法
JPH02227908A (ja) フェライトチップ部品
JPH0737420A (ja) 導体ペースト組成物及びそれを用いた回路基板
JPS6033897A (ja) 銀ロウ
JPS63283184A (ja) 導体組成物を被覆した回路基板
JP2668569B2 (ja) ロウ付け用材料
JPH10193170A (ja) 半田付け物品
JPH10106346A (ja) 銀系導体ペースト
JP2759296B2 (ja) ロウ付け用材料
JP2759297B2 (ja) リード付き電子部品
JP2686548B2 (ja) ロウ付け用材料
JP2742624B2 (ja) メタライズ金属層を有するアルミナ質焼結体
JPS6148493A (ja) メタライズ用組成物
JPS58130590A (ja) セラミツク配線基板および該セラミツク配線基板を用いた厚膜ハイブリツドic
JPS60255684A (ja) メタライズ用組成物
JPS6251497B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term