JPH0435278B2 - - Google Patents
Info
- Publication number
- JPH0435278B2 JPH0435278B2 JP60111867A JP11186785A JPH0435278B2 JP H0435278 B2 JPH0435278 B2 JP H0435278B2 JP 60111867 A JP60111867 A JP 60111867A JP 11186785 A JP11186785 A JP 11186785A JP H0435278 B2 JPH0435278 B2 JP H0435278B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy solder
- foil material
- oxygen content
- less
- thermal fatigue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Die Bonding (AREA)
- Continuous Casting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11186785A JPS61269998A (ja) | 1985-05-24 | 1985-05-24 | Ｓｎ合金はんだ箔材の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11186785A JPS61269998A (ja) | 1985-05-24 | 1985-05-24 | Ｓｎ合金はんだ箔材の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61269998A JPS61269998A (ja) | 1986-11-29 |
| JPH0435278B2 true JPH0435278B2 (cs) | 1992-06-10 |
Family
ID=14572151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11186785A Granted JPS61269998A (ja) | 1985-05-24 | 1985-05-24 | Ｓｎ合金はんだ箔材の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61269998A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2340393A1 (en) * | 1999-06-11 | 2000-12-21 | Katsuaki Suganuma | Lead-free solder |
| JP2002361405A (ja) * | 2000-09-25 | 2002-12-18 | Showa Denko Kk | 熱交換器の製造方法 |
| US20040187976A1 (en) | 2003-03-31 | 2004-09-30 | Fay Hua | Phase change lead-free super plastic solders |
| JP5161847B2 (ja) * | 2009-08-18 | 2013-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR102217782B1 (ko) | 2013-05-10 | 2021-02-18 | 후지 덴키 가부시키가이샤 | 반도체 장치 및 반도체 장치의 제조방법 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586793A (ja) * | 1981-07-03 | 1983-01-14 | Hitachi Ltd | ろう材 |
-
1985
- 1985-05-24 JP JP11186785A patent/JPS61269998A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61269998A (ja) | 1986-11-29 |
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