JPH04350949A - 電子部品の樹脂封止成形装置 - Google Patents
電子部品の樹脂封止成形装置Info
- Publication number
- JPH04350949A JPH04350949A JP15571991A JP15571991A JPH04350949A JP H04350949 A JPH04350949 A JP H04350949A JP 15571991 A JP15571991 A JP 15571991A JP 15571991 A JP15571991 A JP 15571991A JP H04350949 A JPH04350949 A JP H04350949A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molds
- outside air
- resin
- air blocking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims description 100
- 229920005989 resin Polymers 0.000 title claims description 100
- 230000000903 blocking effect Effects 0.000 claims description 72
- 238000000465 moulding Methods 0.000 claims description 40
- 238000007789 sealing Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 28
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 16
- 230000009471 action Effects 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15571991A JPH04350949A (ja) | 1991-05-28 | 1991-05-28 | 電子部品の樹脂封止成形装置 |
| GB9418909A GB2280144B (en) | 1991-01-17 | 1992-01-10 | Apparatus for molding resin to seal an electronic part |
| GB9200609A GB2252746B (en) | 1991-01-17 | 1992-01-10 | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
| MYPI92000061A MY108182A (en) | 1991-01-17 | 1992-01-15 | A method of molding resin sealing of semiconductor device and apparatus thereof |
| KR1019920000661A KR920015493A (ko) | 1991-01-17 | 1992-01-17 | 반도체 장치의 수지 봉지 성형방법 및 장치 |
| NL9200089A NL194666C (nl) | 1991-01-17 | 1992-01-17 | Werkwijze en inrichting voor het door persgieten in kunsthars insluiten van een elektronisch deel. |
| US08/173,150 US5435953A (en) | 1991-01-17 | 1993-12-21 | Method of molding resin for sealing an electronic device |
| US08/273,025 US5507633A (en) | 1991-01-17 | 1994-07-08 | Resin molding apparatus for sealing an electronic device |
| HK181095A HK181095A (en) | 1991-01-17 | 1995-11-30 | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
| HK180995A HK180995A (en) | 1991-01-17 | 1995-11-30 | Apparatus for molding resin to seal an electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15571991A JPH04350949A (ja) | 1991-05-28 | 1991-05-28 | 電子部品の樹脂封止成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04350949A true JPH04350949A (ja) | 1992-12-04 |
| JPH0563938B2 JPH0563938B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-13 |
Family
ID=15611995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15571991A Granted JPH04350949A (ja) | 1991-01-17 | 1991-05-28 | 電子部品の樹脂封止成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04350949A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227435A (ja) * | 1983-06-08 | 1984-12-20 | Mitsubishi Metal Corp | トランスフア成形用金型 |
| JPS6361132U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-10-09 | 1988-04-22 |
-
1991
- 1991-05-28 JP JP15571991A patent/JPH04350949A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227435A (ja) * | 1983-06-08 | 1984-12-20 | Mitsubishi Metal Corp | トランスフア成形用金型 |
| JPS6361132U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-10-09 | 1988-04-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563938B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |