JPH0434827B2 - - Google Patents

Info

Publication number
JPH0434827B2
JPH0434827B2 JP58135150A JP13515083A JPH0434827B2 JP H0434827 B2 JPH0434827 B2 JP H0434827B2 JP 58135150 A JP58135150 A JP 58135150A JP 13515083 A JP13515083 A JP 13515083A JP H0434827 B2 JPH0434827 B2 JP H0434827B2
Authority
JP
Japan
Prior art keywords
resin
heat dissipation
resin layer
heat
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58135150A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6028252A (ja
Inventor
Takao Emoto
Hiroshi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58135150A priority Critical patent/JPS6028252A/ja
Publication of JPS6028252A publication Critical patent/JPS6028252A/ja
Publication of JPH0434827B2 publication Critical patent/JPH0434827B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W40/251—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58135150A 1983-07-26 1983-07-26 樹脂封止半導体装置 Granted JPS6028252A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58135150A JPS6028252A (ja) 1983-07-26 1983-07-26 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58135150A JPS6028252A (ja) 1983-07-26 1983-07-26 樹脂封止半導体装置

Publications (2)

Publication Number Publication Date
JPS6028252A JPS6028252A (ja) 1985-02-13
JPH0434827B2 true JPH0434827B2 (cg-RX-API-DMAC10.html) 1992-06-09

Family

ID=15144978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58135150A Granted JPS6028252A (ja) 1983-07-26 1983-07-26 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6028252A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
JPH07102071B2 (ja) * 1990-04-27 1995-11-08 東亜交易株式会社 魚頭切除方法
US5165219A (en) * 1990-11-29 1992-11-24 House Food Industrial Co., Ltd. Packing device for articles that have directionality

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521175A (en) * 1978-08-02 1980-02-15 Nec Home Electronics Ltd Semiconductor device
JPS57211761A (en) * 1981-06-23 1982-12-25 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6028252A (ja) 1985-02-13

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