JPH0433133B2 - - Google Patents

Info

Publication number
JPH0433133B2
JPH0433133B2 JP58125301A JP12530183A JPH0433133B2 JP H0433133 B2 JPH0433133 B2 JP H0433133B2 JP 58125301 A JP58125301 A JP 58125301A JP 12530183 A JP12530183 A JP 12530183A JP H0433133 B2 JPH0433133 B2 JP H0433133B2
Authority
JP
Japan
Prior art keywords
resin
support
semiconductor device
sealed
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58125301A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6016451A (ja
Inventor
Hiroyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP58125301A priority Critical patent/JPS6016451A/ja
Publication of JPS6016451A publication Critical patent/JPS6016451A/ja
Publication of JPH0433133B2 publication Critical patent/JPH0433133B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/0198—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58125301A 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法 Granted JPS6016451A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58125301A JPS6016451A (ja) 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58125301A JPS6016451A (ja) 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6016451A JPS6016451A (ja) 1985-01-28
JPH0433133B2 true JPH0433133B2 (enExample) 1992-06-02

Family

ID=14906693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58125301A Granted JPS6016451A (ja) 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6016451A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9562872B2 (en) 2012-05-29 2017-02-07 3M Innovative Properties Company Humidity sensor and sensor element

Also Published As

Publication number Publication date
JPS6016451A (ja) 1985-01-28

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