JPH0432347B2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a semiconductor device testing device for efficiently testing semiconductor devices mounted on a printed circuit board.

[Conventional technology]

Conventionally, printed circuit boards with semiconductor devices, resistors, capacitors, and other components mounted on one or both sides have to be tested one by one or by sampling a predetermined number of boards to determine whether they work properly. I was inspecting it. The inspection at that time was performed by bringing a probe needle into contact with the terminal of each semiconductor device. In such inspections, if the semiconductor device is mounted in a method called a flat package, the lead wires that serve as terminals from the container are soldered to the electrodes on the printed circuit board on the side of the container. As shown in FIGS. 7 to 9, the lead wire 47 drawn out from the container 45
is folded back to the bottom of the container 45 and the printed circuit board 41
When soldering to the upper electrode 43, the semiconductor device and the testing device were electrically connected by bringing the probe needle 51 into contact with the shoulder 49 formed by bending the lead wire 47. .

[Problems to be solved by the invention]

However, the above method has the drawback that it is difficult to reliably bring the probe needle 51 into contact with the shoulder portion 49 of the lead wire 47, which has a very small area, and poor contact is likely to occur. Further, when the lead wire 47 drawn out from the container 45 is folded back to the bottom side of the container 45 and soldered to the electrode 43 on the printed circuit board 41, the lead wire 47 is
It is difficult to accurately attach the soldered part 7 to the electrode 43 on the printed circuit board 41, and the electrode 4
As shown in FIG. 10, if the soldering part 53 on the top 3 is shifted in the θ direction rather than in the X or Y direction, the probe needle 51 will hit the container 45 and will not be able to reach the lead wire 47. It was hot. The semiconductor device testing device of the present invention is intended to eliminate the above-mentioned drawbacks of the conventional example, and is designed to secure a larger space for contact between the semiconductor device under test and the probe needle, and to provide a lead wire that serves as a terminal. The area can be made similar to that of the electrodes soldered to the printed circuit board on the side of the container, and the deviation in the θ direction can be absorbed so that inspection can be performed simply and quickly.

[Means to solve the problem]

As shown in FIGS. 1 and 2 of the embodiment drawings, the semiconductor device testing device of the present invention is a semiconductor device testing device that tests a semiconductor device by bringing a terminal of the semiconductor device into contact with a probe needle. Between the terminal of the device and the probe needle, there is a fixed cover that is fitted onto the top surface of the semiconductor device and has an insertion hole for the relay probe needle. A relay device having an electrode support plate having a predetermined pattern of electrodes electrically connected to the relay probe needle formed on the upper surface is interposed, and the tip of the relay probe needle is connected to the terminal of the semiconductor device through the insertion hole of the fixed cover, The present invention is characterized in that a probe needle is connected to the electrode for inspection.

[Effect]

Since the semiconductor device inspection apparatus of the present invention employs a mechanism that absorbs the pressure from the probe needle, it is possible to apply the pressure from the probe needle to the semiconductor device evenly.

【Example】

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor device inspection apparatus of the present invention will be described in detail below with reference to the drawings. In FIGS. 1 and 2, 1 is a semiconductor device consisting of a flat package, and lead wires 5 drawn out from a container 3 are folded back under the container 3 and soldered to electrodes on a printed circuit board. has been done. This semiconductor device 1 connects its terminals, that is, the lead wires 5 and the probe needle of the inspection device to a relay 7.
Tested by contacting through the This relay 7 includes a fixed cover 9 that is fitted onto the top surface of the semiconductor device 1 and has an insertion hole 15 for the relay probe needle 13, and is elastically supported by the fixed cover 9, and has the relay probe needle 13 attached thereto. The electrode support plate 11 has a predetermined pattern of electrodes 17 electrically connected to the relay probe needles 13 formed on its upper surface. The fixed cover 9 has a vertically disposed cylindrical portion 19 that tightly engages the periphery of the semiconductor device 1 . Further, the electrode support plate 11 is composed of a laminated plate 23 mounted on a connecting plate 21. This electrode support plate 11
Electrodes 17 formed on the laminated plate 23 and having a circular pattern or the like arranged at approximately equal intervals are electrically connected to the relay probe needle 13. This electrode support plate 11 is fixed to the fixed cover 9 with a screw 25, and a spring 2 attached to this screw 25
7 and are maintained at a predetermined interval. 29 is a guide pin for accurately sliding the electrode support plate 11 on the fixed cover 9. 3 and 4 show examples of the relay probe needle 13. FIG. 3 shows one with a pointed tip, and FIG. 4 shows a slit 33 with a bulge 35 at the tip. This is what I did. Both lead wires 5
It is possible to make an electrical connection by firmly adhering to the 5 and 6 show a mechanism for automatically inspecting the semiconductor device 1.
In the figure, an inclined groove 37 is bored in the screw 25, and a protrusion that is fitted into the groove 37 is provided protruding toward the fixed cover 9, so that the fixed cover 9 is slightly twisted relative to the electrode support plate 11. It is made to be able to rotate. Further, in FIG. 6, the repeater 7 is elastically attached to a repeater support plate 39 having the same size as, for example, a printed circuit board on which a semiconductor device is mounted, and is also rotatable in a torsional direction. In the mechanism shown in FIGS. 5 and 6 above, since the fixed cover 9 is elastically engaged with the semiconductor device 1, errors in the twisting direction can be easily absorbed, and the mechanism is suitable for automation. can. The operation of the semiconductor device inspection apparatus of the present invention will be explained. First, the relay 7 is placed over the semiconductor device 1 on a printed circuit board, and the fixed cover 9 is brought into close contact with the semiconductor device 1 through the cylindrical portion 19 . Next, when the inspection device is activated and the probe needle of the inspection device contacts and presses the electrode 17 on the electrode support plate 11, the electrode support plate 11 is lowered to the fixed cover 9 side, and the relay probe needle 13 is attached to the semiconductor device. The lead wire 5 of No. 1 comes into contact with the lead wire 5 of No. 1. At this time, the probe needle of the inspection device reliably contacts the electrode 17 of the electrode support plate 11, which has a much larger area than the shoulder of the lead wire 5. When the test is completed, the pressure on the probe needle of the test device is released. When the pressure is released, the electrode support plate 11 is automatically returned to its original position by the spring 27.

【Effect of the invention】

The semiconductor device testing device of the present invention uses a repeater having an electrode support plate on which electrodes are formed and a fixed cover that elastically holds the support plate, so that a large space for the electrodes can be secured. Moreover, it has become possible to absorb deviations in the θ direction and perform simple and rapid inspections.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor device inspection apparatus of the present invention, FIG. 2 is a plan view of an electrode support plate, and FIGS. 3 and 4 are perspective views showing an example of a relay probe needle. Figures 5 and 6 are perspective views showing an example in which semiconductor devices can be automatically inspected, Figure 7 is a perspective view showing an example of a flat package, and Figure 8 is a state in which the probe needle is attached in a conventional example. FIG. 9 is a sectional view showing the connection between the lead wire and the probe needle in the conventional example, and FIG. 10 is a schematic diagram showing the relationship between the electrode and the soldered part. 1...Semiconductor device, 3...Container, 5...Lead wire, 7...Relay device, 9...Fixed cover, 11...
Electrode support plate, 13... Relay probe needle, 15...
Insertion hole, 17... Electrode, 19... Cylindrical part, 21...
...Connecting plate, 23...Laminated plate, 25...Screw, 27
...Spring, 29...Guide pin.

Claims (1)

[Claims] 1. In a semiconductor device testing device that tests a semiconductor device by bringing the terminal of the semiconductor device into contact with a probe needle, an insertion hole for the relay probe needle is inserted between the terminal of the semiconductor device and the probe needle, and is inserted into the top surface of the semiconductor device. A relay comprising: a fixed cover having a perforation therein; and an electrode support plate which is elastically supported by the fixed cover, has a relay probe needle attached thereto, and has a predetermined pattern of electrodes formed on its upper surface, which is electrically connected to the relay probe needle. A device for testing a semiconductor device, characterized in that the tip of a relay probe needle is connected to a terminal of a semiconductor device through an insertion hole of a fixed cover, and the probe needle is connected to the electrode for inspection. .