JPH06294815A - Inspection method for mounted parts - Google Patents
Inspection method for mounted partsInfo
- Publication number
- JPH06294815A JPH06294815A JP5080367A JP8036793A JPH06294815A JP H06294815 A JPH06294815 A JP H06294815A JP 5080367 A JP5080367 A JP 5080367A JP 8036793 A JP8036793 A JP 8036793A JP H06294815 A JPH06294815 A JP H06294815A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- component
- contact portion
- contact
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【目的】 実装部品の接続部位を測定することで実装の
有無を検査する検査方法を提供することを目的とする。
【構成】 プリント配線基板1のパターン2に針状の接
触部7を持ったプローブ8を当接し、部品の端子にブラ
シ状の接触部9を持ったプローブ10を当接することで
2つの接触部間の導通状態が測定できるため、部品が実
装されているかの有無を検査できる。
(57) [Summary] [Purpose] It is an object to provide an inspection method for inspecting the presence or absence of mounting by measuring the connection part of the mounted component. Constitution: A probe 8 having a needle-shaped contact portion 7 is brought into contact with the pattern 2 of the printed wiring board 1, and a probe 10 having a brush-shaped contact portion 9 is brought into contact with a terminal of a component, thereby forming two contact portions. Since the conduction state between them can be measured, it can be inspected whether or not the component is mounted.
Description
【0001】[0001]
【産業上の利用分野】本発明は、プリント配線基板に実
装された部品の検査方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of inspecting a component mounted on a printed wiring board.
【0002】[0002]
【従来の技術】従来、プリント配線基板に部品を半田付
け等で実装し、実装した部品が正しい位置に正しいもの
が装着されているかどうかを検査する検査装置としては
インピーダンスチェッカーまたは機能チェッカー等が使
用される。これらによる検査の方法としてはテストポイ
ントを決め上記チェッカーのプローブ支持台をテストポ
イントの上部に移動して、同プローブ支持台の下面に設
けられた先端に針状の接触部を持った2つのプローブで
テストポイント間のインピーダンスを測定し、実装部品
の有無、実装部品の抵抗値等を測定していた。ところ
が、図2のAに示すように、100μFのコンデンサと
0・1μFのコンデンサが電源と接地間に並列に接続さ
れているような場合には0・1μFのコンデンサが装着
されていなくてもチェッカーの判定は良となる。また、
図2のBに示すように、0・1μFのバイパスコンデン
サが5個並列に接続されているような場合には1個が装
着されなくてもチェッカーの判定は良となり、欠品があ
るにもかかわらず誤判定される問題があった。2. Description of the Related Art Conventionally, an impedance checker or a function checker has been used as an inspection device for mounting a component on a printed wiring board by soldering or the like, and inspecting whether the mounted component is mounted in the correct position or not. To be done. As an inspection method by these, a test point is determined, and the probe support base of the above-mentioned checker is moved to the upper part of the test point, and two probes having a needle-shaped contact portion at the tip provided on the lower surface of the probe support base are tested. The impedance between the test points was measured by measuring the presence / absence of mounted components, the resistance value of the mounted components, and so on. However, as shown in FIG. 2A, when a 100 μF capacitor and a 0.1 μF capacitor are connected in parallel between the power supply and ground, the checker does not need to be installed even if the 0.1 μF capacitor is installed. Is judged to be good. Also,
As shown in FIG. 2B, in the case where five 0.1 μF bypass capacitors are connected in parallel, the checker's judgment is good even if one bypass capacitor is not installed, and even if there is a missing item. Regardless, there was a problem of being erroneously judged.
【0003】[0003]
【発明が解決しようとする課題】本発明は、上記従来の
問題点に鑑みなされたもので、実装部品の接続部位を測
定することで部品が確実に実装されていることを検査す
る検査方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and provides an inspection method for inspecting that a component is surely mounted by measuring the connection site of the mounted component. The purpose is to provide.
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
に本発明では、部品等を実装したプリント配線基板を検
査するインピーダンスチェッカー等のプローブ支持台に
装着されたプローブの先端に針状およびブラシ状の接触
部を設け、プリント配線基板のパターンに前記針状の接
触部を当接し、前記部品の端子に前記ブラシ状の接触部
を当接し、前記2つの接触部の導通を測定することを特
徴とする。In order to solve the above problems, according to the present invention, a needle-shaped brush and a brush are attached to the tip of a probe mounted on a probe support base such as an impedance checker for inspecting a printed wiring board on which components and the like are mounted. A contact portion is provided, the needle-shaped contact portion is brought into contact with the pattern of the printed wiring board, the brush-like contact portion is brought into contact with the terminal of the component, and conduction between the two contact portions is measured. Characterize.
【0005】[0005]
【作用】上記構成によれば、プリント配線基板のパター
ンに針状の接触部を持ったプローブを当接し、部品の端
子にブラシ状の接触部を持ったプローブを当接すること
で2つの接触部間の導通状態が測定できるので、部品の
実装の有無を検査できる。According to the above construction, the probe having the needle-shaped contact portion is brought into contact with the pattern of the printed wiring board, and the probe having the brush-like contact portion is brought into contact with the terminal of the component, whereby two contact portions are provided. Since the conduction state between them can be measured, it is possible to inspect whether or not the component is mounted.
【0006】[0006]
【実施例】本発明の実施例を添付図面を参照して詳細に
説明する。図1に示すように、1はプリント配線基板
で、上面にパターン2が形成されている。3は部品で、
両端に接続のための端子4が設けられ、同端子4はパタ
ーン2に半田5にて接続されている。6はプローブ支持
台で、図示しないインピーダンスチェッカーに接続され
ており、同プローブ支持台6には先端に針状の接触部7
を持っプローブ8と先端に弾性のある金属細線が植毛さ
れているブラシ状の接触部9を持っプローブ10が装着
されている。プローブ8はスプリング構造になっていて
先端が試料に当接すると上下方向に収縮する構造になっ
ており当接部位と圧接する。一方、プローブ10のブラ
シ状の接触部9は弾性を持ち部品の凹凸形状に沿って部
品面に確実に接触する構造になっている。上記構成にお
いて、プリント配線基板1は検査台に固定され、プロー
ブ支持台6は水平・垂直方向に制御されて自由に移動す
る。プローブ支持台6は実装部品3の有無を検査するた
めに、同部品3の上部に移動した後、プリント配線基板
1面に降下し、プローブ8の針状の接触部7がパターン
2に接触し、プローブ10のブラシ状の接触部9が端子
4に接触した所で停止する。そして針状の接触部7とブ
ラシ状の接触部9間の導通を測定し、実装部品がパター
ン2と接続している時は導通があり、接続していない時
には導通がないため部品実装の有無を判定することがで
きる。Embodiments of the present invention will be described in detail with reference to the accompanying drawings. As shown in FIG. 1, a printed wiring board 1 has a pattern 2 formed on its upper surface. 3 is a part,
Terminals 4 for connection are provided at both ends, and the terminals 4 are connected to the pattern 2 with solder 5. A probe support 6 is connected to an impedance checker (not shown), and the probe support 6 has a needle-shaped contact portion 7 at its tip.
A probe 10 having a brush-like contact portion 9 having a thin metal wire having elasticity implanted therein is attached to the probe 8. The probe 8 has a spring structure, and when the tip of the probe 8 contacts the sample, the probe 8 contracts in the vertical direction and comes into pressure contact with the contact portion. On the other hand, the brush-shaped contact portion 9 of the probe 10 has elasticity and is structured to surely contact the component surface along the uneven shape of the component. In the above structure, the printed wiring board 1 is fixed to the inspection table, and the probe support table 6 is controlled in the horizontal / vertical directions to move freely. In order to inspect the presence / absence of the mounted component 3, the probe support base 6 moves to the upper part of the component 3 and then descends to the surface of the printed wiring board 1, and the needle-shaped contact portion 7 of the probe 8 contacts the pattern 2. , The brush-shaped contact portion 9 of the probe 10 stops when it comes into contact with the terminal 4. Then, the conduction between the needle-shaped contact portion 7 and the brush-shaped contact portion 9 is measured, and when the mounted component is connected to the pattern 2, there is conduction, and when the mounted component is not connected, there is no conduction. Can be determined.
【0007】[0007]
【発明の効果】以上のように本発明においては、インピ
ーダンスチェッカー等の検査方法では検出できないバイ
パスコンデンサ等の欠品を確実に検出することができる
ので、従来の目視検査は省略でき、検査費用の低減およ
び機械化による信頼性の向上が図れる。As described above, according to the present invention, a defective product such as a bypass capacitor which cannot be detected by an inspection method such as an impedance checker can be surely detected, so that the conventional visual inspection can be omitted and the inspection cost can be reduced. Reliability can be improved by reduction and mechanization.
【図1】本発明の実装部品の検査方法の一実施例を示す
側部外観図である。FIG. 1 is a side external view showing an embodiment of a mounting component inspection method of the present invention.
【図2】実装部品の一例を示す接続図である。FIG. 2 is a connection diagram showing an example of mounted components.
1 プリント配線基板 2 パターン 3 部品 4 端子 5 半田 6 プローブ支持台 7 針状の接触部 8 プローブ 9 ブラシ状の接触部 10 プローブ 1 Printed wiring board 2 Pattern 3 Parts 4 Terminal 5 Solder 6 Probe support 7 Needle-shaped contact part 8 Probe 9 Brush-shaped contact part 10 Probe
Claims (1)
査するインピーダンスチェッカー等のプローブ支持台に
装着されたプローブの先端に針状およびブラシ状の接触
部を設け、プリント配線基板のパターンに前記針状の接
触部を当接し、前記部品の端子に前記ブラシ状の接触部
を当接し、前記2つの接触部の導通を測定するようにし
たことを特徴とする実装部品の検査方法。1. A needle-shaped or brush-shaped contact portion is provided at a tip of a probe mounted on a probe support base such as an impedance checker for inspecting a printed wiring board on which components and the like are mounted, and the needle is provided on a pattern of the printed wiring board. -Shaped contact portion is brought into contact, the brush-shaped contact portion is brought into contact with the terminal of the component, and the conduction between the two contact portions is measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5080367A JPH06294815A (en) | 1993-04-07 | 1993-04-07 | Inspection method for mounted parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5080367A JPH06294815A (en) | 1993-04-07 | 1993-04-07 | Inspection method for mounted parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06294815A true JPH06294815A (en) | 1994-10-21 |
Family
ID=13716302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5080367A Pending JPH06294815A (en) | 1993-04-07 | 1993-04-07 | Inspection method for mounted parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06294815A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008140889A (en) * | 2006-11-30 | 2008-06-19 | Fujitsu Ltd | Misinsertion detection structure and misinsertion detection method for polarized parts on printed circuit board |
| CN115103530A (en) * | 2022-08-25 | 2022-09-23 | 苏州浪潮智能科技有限公司 | Circuit board and gold finger gold plating method thereof |
-
1993
- 1993-04-07 JP JP5080367A patent/JPH06294815A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008140889A (en) * | 2006-11-30 | 2008-06-19 | Fujitsu Ltd | Misinsertion detection structure and misinsertion detection method for polarized parts on printed circuit board |
| CN115103530A (en) * | 2022-08-25 | 2022-09-23 | 苏州浪潮智能科技有限公司 | Circuit board and gold finger gold plating method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3537000A (en) | Electrical probe including pivotable contact elements | |
| JPH10142291A (en) | Ic tester | |
| US20010013786A1 (en) | Apparatus and method for evaluating printed circuit board assembly manufacturing processes | |
| JPH06294815A (en) | Inspection method for mounted parts | |
| JPH0829475A (en) | Contact probe of mounted substrate inspection device | |
| JPH07104026A (en) | Soldering defect detection method for mounted components | |
| JP3061899U (en) | Contact probe using conductive rubber for the contact part | |
| JP3276755B2 (en) | Detecting soldering failure of leads on mounted components | |
| CN218629896U (en) | Device for IGBT driver function test | |
| JPH04236368A (en) | Method and apparatus for detecting defective part of soldering of ic mounted on board to be measured | |
| JP3329542B2 (en) | Detecting soldering failure of surface mount components due to lead deformation | |
| JPH0611462Y2 (en) | Contact probe for board inspection | |
| JP3187208B2 (en) | Component presence detection probe for circuit board inspection machine | |
| JP4292013B2 (en) | Circuit board inspection equipment | |
| JPH0815361A (en) | Inspection method for printed wiring board | |
| JPS6140041A (en) | Inspection of electronic parts and device therefore | |
| JPH088456Y2 (en) | Four probe probe checker | |
| JPH04127581U (en) | pogo pin | |
| JPH075220A (en) | Method and apparatus for inspecting mounting state of semiconductor device | |
| JPH0587875A (en) | Mobile probe type insert tester | |
| JPH04145640A (en) | Probe needle | |
| JP2584020Y2 (en) | Probe unit | |
| JPH0317566A (en) | Apparatus for inspecting printed circuit board | |
| JPS6375569A (en) | Tester for substrate inspection | |
| JPH0574901A (en) | Burn-in board checker |