JPS63281079A - Inspection device for semiconductor device - Google Patents

Abstract

PURPOSE:To easily and speedily perform inspection by using an electrode support plate where electrodes are formed and a fixed cover which holds it elastically. CONSTITUTION:A relay 7 is fitted in the top surface of a semiconductor device 1 and provided with the fixed cover 9 which has an insertion hole 15 for a repeating probe stylus 13 and a probe stylus 13 supported elastically by the cover 9, and has the electrode support plate 11 which has electrodes 17 connected electrically to the probe stylus 13 on the top surface in a prescribed pattern. Further, the support plate 11 is fixed to the cover 9 with screws 25 and held at a prescribed intervals with screws 27 fitted to the screws 25. Then the relay 7 is placed covering the device 1 on the printed substrate and the cover 9 is brought into contact with the device 1 by a cylinder part 19. Then an inspection device is operated and the probe stylus of the inspection device is pressed against electrodes 17, so that the support plate 11 moves down to the side of the cover 9, thereby bring the probe stylus 11 into contact with the lead wire 5 of the device 1. At this time, the probe stylus of the inspection device contacts electrodes 17 securely. Thus, the inspection is carried out easily and speedily.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a semiconductor device testing device for efficiently testing a semiconductor device mounted on a printed circuit board.

[Conventional technology]

Conventionally, printed circuit boards with semiconductor devices, resistors, capacitors, and other components mounted on one or both sides are inspected one by one, or a predetermined number of boards are sampled to see if they work properly. was. The inspection at that time was performed by bringing a probe needle into contact with the terminal of each semiconductor device. In such inspections, if the semiconductor device is mounted in a method called a flat package, the lead wires that serve as terminals from the container are soldered to the electrodes on the printed circuit board on the side of the container. 7
As shown in FIGS. 9 to 9, when the lead wire 47 drawn out from the container 45 is folded back to the lower side of the container 45 and soldered to the electrode 43 on the printed circuit board 41, the lead wire 47 is folded. The semiconductor device and the testing device were electrically connected by bringing the probe needle 51 into contact with the bent shoulder portion 49.

[Problems to be solved by the invention]

However, the above method has the drawback that it is difficult to reliably bring the probe needle 51 into contact with the shoulder portion 49 of the lead wire 47, which has a very small area, and poor contact is likely to occur. Also, connect the lead wire 47 drawn out from the container 45 to the container 45.
When folding the lead wire 47 downward and soldering it to the electrode 43 on the printed circuit board 41, it is difficult to solder the lead wire 47 to the electrode 43 on the printed circuit board 41 accurately. The soldering part 53 is the first
As shown in Figure 0, there is a drawback that if the probe needle 51 is shifted in the θ direction rather than in the X or Y direction, the probe needle 51 hits the container 45 and cannot reach the lead wire 47. The device attempts to eliminate the above-mentioned drawbacks of the conventional example, and it secures a larger space for contact between the semiconductor device under test and the probe needle, and the lead wires that serve as terminals are printed on the side of the container. It can be made to have the same area as that soldered to the electrode on the board, and can absorb deviations in the θ direction, allowing for simple and quick inspection.

[Means to solve the problem]

As shown in FIGS. 1 and 2 of the embodiment drawings, the semiconductor device testing device of the present invention is a semiconductor device testing device that tests a semiconductor device by bringing a terminal of the semiconductor device into contact with a probe needle. Between the terminal of the device and the probe needle, there is a fixed cover that is fitted onto the top surface of the semiconductor device and has an insertion hole for the relay probe needle. A relay device having an electrode support plate having a predetermined pattern of electrodes electrically connected to the relay probe needle formed on the upper surface is interposed, and the tip of the relay probe needle is connected to the terminal of the semiconductor device through the insertion hole of the fixed cover, The present invention is characterized in that a probe needle is connected to the electrode for inspection.

[Effect]

Since the semiconductor device inspection apparatus of the present invention employs a mechanism that absorbs the pressure from the probe needle, it is possible to apply the pressure from the probe needle to the semiconductor device evenly.

【Example】

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor device inspection apparatus of the present invention will be described in detail below with reference to the drawings. In FIGS. 1 and 2, l is a semiconductor device consisting of a flat package, and lead wires 5 drawn out from a container 3 are folded back to the bottom of the container 3 and soldered to electrodes on a printed circuit board. ing. This semiconductor device 1 is tested by bringing its terminal, ie, the lead wire 5, into contact with the probe needle of the testing device via a repeater 7. This relay device 7 includes a fixed cover 9 that is fitted onto the top surface of the semiconductor device l and has an insertion hole 15 for the relay probe needle 13, and is elastically supported by the fixed cover 9, and has the relay probe needle 13 attached thereto. The electrode support plate 11 has a predetermined pattern of electrodes 17 electrically connected to the relay probe needles 13 formed on its upper surface. The fixed cover 9 has a vertically disposed cylindrical portion 19 that tightly engages the periphery of the semiconductor device 1 . Further, the electrode support plate 11 is connected to the dead layer plate 2 mounted on the connecting plate 21.
It consists of 3. Electrodes 17 formed on the laminated plate 23 of the electrode support plate it and arranged in a circular pattern or the like arranged at approximately equal intervals are electrically connected to the relay probe needles 13. The electrode support plate 11 is fixed to the fixed cover 9 with screws 25, and is held at a predetermined interval by springs 27 attached to the screws 25. 29 is a guide pin for accurately sliding the electrode support plate 11 on the fixed cover 9. 3 and 4 show examples of the relay probe needle 13. FIG. 3 shows one with a pointed tip, and FIG. 4 shows one with a slit 33 and a bulge 31 at the tip. This is what I did. Both can be reliably brought into close contact with the lead wire 5 and electrically connected. 5 and 6 show an example in which the semiconductor device M1 can be automatically inspected.
A groove 37 inclined at 5 is bored, and this tI! By providing a protrusion that fits into I37 on the fixed cover 9 side,
The electrode support plate 11 is made to rotate. Further, in FIG. 6, the repeater 7 is elastically attached to a repeater support plate 39 having the same size as, for example, a printed circuit board on which a semiconductor device is mounted, so that the repeater 7 can be rotated. The operation of the semiconductor device inspection apparatus according to the present invention will be explained. First, the repeater 7 is placed over the semiconductor device l on the printed circuit board, and the fixed cover 9 is brought into close contact with the semiconductor device l using the cylindrical portion 19. Next, the inspection device is activated, and the electrode 1 on the electrode support plate 11 is
When the probe needle of the inspection device is brought into contact with 7 and pressed, the electrode support plate 11 is lowered toward the fixed cover 9, and the relay probe needle 13 is connected to the semiconductor device! It comes into contact with the glued wire 5. At this time, the probe needle of the inspection device reliably contacts the electrode 17 of the electrode support plate 11, which has a much larger area than the shoulder of the lead wire 5. When the test is completed, the pressure on the probe needle of the test device is released. When the pressure is released, the electrode support plate 11 releases the spring 27.
automatically returns to its original position.

【Effect of the invention】

The semiconductor device testing device of the present invention uses a repeater having an electrode support plate on which electrodes are formed and a fixed cover that elastically holds the support plate, so that a large space for the electrodes can be secured. Moreover, it has become possible to absorb deviations in the θ direction and perform simple and quick inspections.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor device inspection apparatus of the present invention, FIG. 2 is a plan view of an electrode support plate, and FIGS. 3 and 4 are perspective views showing an example of a relay probe needle. Figures 5 and 6 are perspective views showing an example of a semiconductor device that can be automatically inspected, Figure 7 is a perspective view of an example of a flat package, and Figure 8 shows how the probe needle is attached in a conventional example. FIG. 9 is a cross-sectional view showing the connection between the lead wire and the probe needle in a conventional example, and FIG. 10 is a schematic diagram showing the relationship between the electrode and the soldering portion. l... Semiconductor device M 3... Container 5... Lead wire 7... Relay 9... Fixed cover
11... Electrode support plate 13... Relay probe needle
15...Through hole 17...Electrode 19...
- Cylindrical part 21...Connecting plate 23...Laminated plate 25...Screw 27...Spring 29...
guide pin

Claims (1)

[Claims] 1. In a semiconductor device testing device that tests a semiconductor device by bringing the terminal of the semiconductor device into contact with a probe needle, a relay probe needle is inserted between the terminal of the semiconductor device and the probe needle while being fitted onto the top surface of the semiconductor device. A fixed cover having a hole formed therein; and an electrode support plate elastically supported by the fixed cover, having a relay probe needle attached thereto, and a predetermined pattern of electrodes electrically connected to the relay probe needle formed on the upper surface thereof. Inspection of a semiconductor device, characterized in that a relay is interposed, the tip of a relay probe needle is connected to a terminal of the semiconductor device through an insertion hole of a fixed cover, and the probe needle is connected to the electrode for inspection. Device.