JPS5922539Y2 - probe card - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a probe card used for testing semiconductor products.
This device is suitable for testing a composite semiconductor device in which an IC or the like is mounted, wiring is established between each element on a substrate, and external connection terminals and inspection terminals are provided mainly along the periphery of the substrate.

The number of terminals in such a composite semiconductor device reaches several hundreds, and high-density devices with a terminal interval of 1 mm or less are being realized.

When trying to simultaneously bring the probe into contact with a large number of terminals arranged close together like this, the probe is pressed from above with a compression helical spring and the helical spring is housed in the sleeve, as in the conventional method. This cannot be carried out using a probe card with such a structure.

The purpose of this invention is to manufacture multiple LSIs on one board.

This is a probe card for testing complex semiconductor devices in which ICs, etc. are mounted and electrodes to be tested are scattered over the entire surface of the board, and can also be used for devices with terminals arranged closely at intervals of about 1 mm. The purpose of the present invention is to provide an improved probe card that can be used.

The present invention will be explained below based on drawings of embodiments.

Figure 1 shows an overall view of the probe card.

Usually several hundred probe devices 2 are placed at predetermined positions on an insulating substrate 1.
-2 are arranged scattered over the entire surface of the board, and each probe device is connected to external connection terminals 3...3 on the outer periphery by lead wires, printed wiring, etc.

FIG. 2 shows an enlarged view of the probe device, and FIG. 3 shows its sectional view.

A through hole 4 penetrating both the front and back surfaces of the insulating substrate 1 is formed, and a metal sleeve 5 made of nickel, stainless steel, yellow, etc. is inserted into the through hole and soldered.

A probe 6 made of nickel-plated tungsten, gold-plated brass, palladium alloy, etc. is inserted into this sleeve, and the tip of a rectangular leaf spring 7 made of phosphor bronze or the like is soldered to its upper end. Then, the other end of the leaf spring 7 is soldered to the conductor foil 8 on the board 1.

As shown in FIGS. 1 and 2, the rectangular leaf springs 7...7 are arranged with their longitudinal directions parallel to each other.

When using this probe card, use the external connection terminal 3.
...3 is connected to a prober (testing machine), and the tip of the probe is connected to the terminal of the semiconductor device to be tested.

As a modified embodiment of the present invention, in order to facilitate soldering of the lead wires, the orientation of the leaf springs 7 may be alternated as shown in FIG. 4, or as shown in FIG. , leaf springs 7A and 7B having different lengths may be provided alternately.

According to the present invention, since a rectangular leaf spring that is much smaller than the board is used, hundreds of probe devices 2 can be arranged flat on the board, resulting in a simple configuration. A probe card for testing complex semiconductor devices can be manufactured.

In addition, the arrangement density is 0.7 mm = 0.
．． Although the distance between the probes is approximately 3 mm, the distance between the probes is 0.9 mm.
It can be easily approached to a distance of about 0.5 mm.

Further, since the shape and dimensions of the rectangular leaf spring are uniform, the contact pressure of the probe can be easily made uniform, and furthermore, it is suitable for mass production and is economical.

[Brief explanation of the drawing]

Fig. 1 is an overall plan view of an embodiment of the present invention, Fig. 2 is an enlarged plan view of the probe device 2, Fig. 3 is a sectional view of Fig. 2, and Figs. 4 and 5 are the probe of the present invention. FIG. 2 is an enlarged plan view showing another embodiment of the device 2; DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Probe device, 3... External connection terminal, 4... Through hole, 6... Probe, 7.
7A. 7B, 7C... leaf springs.

Claims (1)

[Scope of utility model registration request] A plurality of probes that contact the electrodes of the semiconductor to be tested are scattered over the entire surface of the insulating substrate, and a plurality of external connection terminals are provided around the insulating substrate to connect each of the probes to the prober. In the device, a through hole is provided that penetrates both the front and back surfaces of the insulating substrate, and a probe that slides inside the through hole is inserted. One end of a rectangular leaf spring, which is extremely short in length, is joined to one end of the probe, and the other end of each rectangular leaf spring is fixed on the insulating substrate so that the longitudinal directions are parallel to each other. A probe card characterized in that a needle is slidably supported and a rectangular plate spring thereof is connected to the external connection terminal.