JPH0815171B2 - Semiconductor element inspection equipment - Google Patents
Semiconductor element inspection equipmentInfo
- Publication number
- JPH0815171B2 JPH0815171B2 JP62128169A JP12816987A JPH0815171B2 JP H0815171 B2 JPH0815171 B2 JP H0815171B2 JP 62128169 A JP62128169 A JP 62128169A JP 12816987 A JP12816987 A JP 12816987A JP H0815171 B2 JPH0815171 B2 JP H0815171B2
- Authority
- JP
- Japan
- Prior art keywords
- coil spring
- electrode pin
- probe head
- electrode
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、高密度プローブヘッドを有する半導体素子
検査装置に係り、特に高寿命で組立性良好なバネ性を有
する電極ピンの構造に関する。Description: TECHNICAL FIELD The present invention relates to a semiconductor device inspection apparatus having a high-density probe head, and more particularly to a structure of an electrode pin having a long life and a spring property with good assemblability.
従来の装置は、特開昭58−2755号に記載のように、バ
ネ性を有する接触ピン（電極ピン）の構造が、板状の薄
い金属片で作られている。接触ピンの構造は、上記した
直線状の金属片をあらかじめ塑性的にたわませておく。
この時、接触圧力（接触荷重）は、上記した接触ピンが
更に押し込まれると曲げ弾性及びもどりばね力により発
生する。In the conventional device, as described in JP-A-58-2755, the structure of a contact pin (electrode pin) having a spring property is made of a plate-shaped thin metal piece. As for the structure of the contact pin, the above-mentioned linear metal piece is plastically bent in advance.
At this time, the contact pressure (contact load) is generated by the bending elasticity and the return spring force when the contact pin is further pushed.
上記従来技術は、バネ性を有する電極ピン（接触ピ
ン）として ｉ）板バネを用いており、コイルバネに比較して構造上
応力が集中し易いため、繰返し圧縮に対して寿命が短
い。The above-mentioned conventional technique uses a leaf spring i) as an electrode pin (contact pin) having a spring property, and structural stress tends to be concentrated in comparison with a coil spring, so that the life is short with respect to repeated compression.
ii）更に、板バネにたわみ部を設けていることにより、
長手方向の中心軸に対して非対称であり、支持体との方
向・位置決め精度が要求されるため、組立工程が複雑化
する、という問題があった。ii) Furthermore, by providing the leaf spring with a flexure,
There is a problem that the assembly process is complicated because it is asymmetric with respect to the central axis in the longitudinal direction, and the direction and positioning accuracy with respect to the support are required.
本発明の目的は、高寿命で組立性の良好なバネ性を有
する電極ピンを備えた半導体素子検査装置を提供するこ
とにある。It is an object of the present invention to provide a semiconductor element inspection device having an electrode pin having a long life and good assembling property and a spring property.
上記目的は、板バネをコイルバネにし、かつコイルバ
ネと電極ピンとを同一材質で一体化構造とすることによ
り達成される。The above object can be achieved by using a leaf spring as a coil spring, and integrating the coil spring and the electrode pin with the same material.
バネ性を有する電極ピンとして、板バネに代り、電極
ピンと一体形構造をとるコイルバネを用いることによ
り、構造上繰り返し圧縮寿命を長くし、かつ軸対称構造
がとれるため支持体への組み込みが簡易化し組立性が向
上する。By using a coil spring that has an integral structure with the electrode pin instead of a leaf spring as the electrode pin having springiness, the structure has a long repeated compression life and an axially symmetric structure can be taken, which simplifies the assembly into the support. Assemblability is improved.
以下、本発明の第１の実施例を第１図により説明す
る。The first embodiment of the present invention will be described below with reference to FIG.
第１図は、高密度なプローブヘッド部１の断面構造を
示し、バネ性を有する電極ピン２は、コイルバネ３の両
端に電極ピン４を設けた一体形構造で形成され、上記電
極ピン２を一定ピッチ５で配置した段差付き透孔６を有
する上下２枚構成のハウジング７により支持されてい
る。上記電極ピン２は、バネ性のある導体材料（Be−C
u,W,ピアノ線等）を用いており、低抵抗化，酸化防止等
のため更に表面にメッキ，スパッタ等によりメタライズ
（Ni,Au,ロジューム）を施してある。一方、ハウジング
７は、段差付き透孔６を高密度でかつ多数個形成するた
め、フォトエッチング加工が可能な絶縁材料として、ガ
ラスセラミックスを使用している。また、ハウジング７
に導体材料（Cu板,Al板）を使用する場合は、段差付き
透孔６の内壁に絶縁性皮膜（ポリイメド膜，酸化膜）を
形成し（図示せず）、上記した電極ピン２との間の電気
的絶縁を確保するようにしてもよい。このようにする
と、電極ピン２の間を導体シールドして相互インダクタ
ンス，相互キャパシタンスを極めて小さくすることがで
き、電気信号の波形歪（なまり）等への影響を小さくで
きる。FIG. 1 shows a cross-sectional structure of a high-density probe head portion 1, in which an electrode pin 2 having a spring property is formed as an integral structure in which electrode pins 4 are provided at both ends of a coil spring 3, and the electrode pin 2 is It is supported by a housing 7 composed of two upper and lower plates having stepped through holes 6 arranged at a constant pitch 5. The electrode pin 2 is made of a conductive material (Be-C
u, W, piano wire, etc.) is used, and the surface is metalized (Ni, Au, rhodium) by plating, spattering, etc. to reduce resistance and prevent oxidation. On the other hand, the housing 7 uses glass ceramics as an insulating material that can be photo-etched, because a large number of stepped through holes 6 are formed at high density. Also, the housing 7
When a conductor material (Cu plate, Al plate) is used for the above, an insulating film (polyimide film, oxide film) is formed on the inner wall of the stepped through hole 6 (not shown), and the above-mentioned electrode pin 2 is formed. You may make it ensure the electrical insulation between them. By doing so, mutual inductance and mutual capacitance can be made extremely small by shielding the conductors between the electrode pins 2, and the influence on the waveform distortion (blurring) of the electric signal can be reduced.
上記プローブヘッド１の組立てに関しては、上記した
電極ピン２とコイルバネ３を軸対称な構造とすることに
より、下側のハウジング７−２に設けた透孔６に電極ピ
ン２を挿入し、次に上側のハウジング７−１をかぶせて
固定する場合、従来問題であった板状バネのたわみ部の
方向，位置決めが不要となり、組立性の向上を実現して
いる。With respect to the assembly of the probe head 1, the electrode pin 2 and the coil spring 3 are made axially symmetric, so that the electrode pin 2 is inserted into the through hole 6 provided in the lower housing 7-2. When the upper housing 7-1 is fixed by covering it, the direction and the positioning of the flexible portion of the plate-shaped spring, which have been a problem in the past, are unnecessary, and the assembling property is improved.
第２図は、本発明に係る半導体素子検査装置における
プローブヘッド部１の周辺部を示した断面図である。FIG. 2 is a sectional view showing a peripheral portion of the probe head portion 1 in the semiconductor device inspection apparatus according to the present invention.
半導体ウエーハ８の１チップ相当部９に形成されたは
んだバンプ（電極パッド）10に、プローブヘッド部１と
ピッチの異なるパット拡大用多層配線基板11,12及び補
強板13とから構成されるプローブカード14（1,11,12,1
3）が、プローブヘッド部１の電極ピン４−２を通して
電気的，機械的に接触し、整合のとれた配線ライン15に
よりはんだバンプ（電極パッド）10のピッチが拡大され
ている。A probe card including solder bumps (electrode pads) 10 formed on a portion 9 of a semiconductor wafer 8 corresponding to one chip, and multi-layer wiring boards 11 and 12 for pad expansion and a reinforcing plate 13 having different pitches from the probe head portion 1 14 (1,11,12,1
3) makes electrical and mechanical contact through the electrode pins 4-2 of the probe head portion 1, and the pitch of the solder bumps (electrode pads) 10 is expanded by the aligned wiring lines 15.
プローブカード14のピッチ拡大用に形成された上記配
線ライン15の端部電極（図示せず）は、支持体16に設け
た同軸コネクタ17と一体化した同軸形コンタクトピン18
と電気的・機械的に接触している。プローブカード14の
電極ピン４−２に対する半導体ウェーハ８のはんだバン
プ10の相対的な位置合せは、プローブカード14の支持体
19と支持体16により構成されるプローブボックス20が基
準になる。An end electrode (not shown) of the wiring line 15 formed for expanding the pitch of the probe card 14 has a coaxial contact pin 18 integrated with a coaxial connector 17 provided on a support 16.
Is in electrical and mechanical contact with. The relative alignment of the solder bumps 10 of the semiconductor wafer 8 with the electrode pins 4-2 of the probe card 14 is determined by the support of the probe card 14.
The probe box 20 constituted by 19 and the support 16 serves as a reference.
第３図は、第２の実施例であり、バネ性を有する電極
ピン21は、コイルバネ22の長手方向における外径が、コ
イルバネ22の両端側23−1,23−２において減少してい
る。これにより電極ピン24−1,24−２のコイルバネ22に
よる支持が構造上強固になされ、ピンの位置精度向上が
図れる。FIG. 3 is a second embodiment, and in the electrode pin 21 having a spring property, the outer diameter in the longitudinal direction of the coil spring 22 is reduced on both end sides 23-1, 23-2 of the coil spring 22. As a result, the support of the electrode pins 24-1 and 24-2 by the coil spring 22 is strengthened structurally, and the pin position accuracy can be improved.
第４図は、第３の実施例であり、バネ性を有する電極
ピン25は、コイルバネ26の長手方向におけるらせんピッ
チ長さ及び外径がコイルバネ26の両端部27−1,27−２に
おいて減少している。これにより、第３図の実施例と同
様の効果を得ることができる。FIG. 4 is a third embodiment, and in the electrode pin 25 having a spring property, the spiral pitch length and the outer diameter in the longitudinal direction of the coil spring 26 are reduced at both ends 27-1 and 27-2 of the coil spring 26. are doing. As a result, the same effect as that of the embodiment shown in FIG. 3 can be obtained.
本発明によれば、応力集中の小さいコイルバネを使用
することができ、かつコイルバネの長手方向の中心軸に
対して軸対称のバネ性を有する電極ピンを形成できるの
で、上記電極ピンの繰り返し圧縮に対する高寿命化及び
組立性向上が図れるという効果がある。According to the present invention, a coil spring with a small stress concentration can be used, and an electrode pin having a spring property that is axisymmetric with respect to the central axis in the longitudinal direction of the coil spring can be formed. There is an effect that the life is extended and the assemblability is improved.
第１図は、本発明の一実施例のプローブヘッド部の断面
図、第２図は、半導体素子検査装置におけるプローブヘ
ッド部の周辺部の断面図、第３図，第４図は、本発明の
他の実施例を示すプローブヘッド部の断面図、である。 2,21,25……バネ性を有する電極ピン 3,22,26……コイルバネ 4,24……電極ピン、７……ハウジングFIG. 1 is a sectional view of a probe head portion of an embodiment of the present invention, FIG. 2 is a sectional view of a peripheral portion of the probe head portion in a semiconductor device inspection apparatus, and FIGS. 3 and 4 show the present invention. It is sectional drawing of the probe head part which shows another Example. 2,21,25 ...... Electrode pin with spring property 3,22,26 ...... Coil spring 4,24 ...... Electrode pin, 7 ...... Housing
フロントページの続き (72)発明者 大久保 雅史 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (56)参考文献 特開 昭60−20743（ＪＰ，Ａ) 実公 昭44−30779（ＪＰ，Ｙ１)Front Page Continuation (72) Inventor Masafumi Okubo 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Pref., Institute of Industrial Science, Hitachi, Ltd. (56) References JP 60-20743 (JP, A) Jitsuko Sho 44 -30779 (JP, Y1)
Claims (2)
信号を伝送するプローブヘッド部を有する半導体素子検
査装置において、 該プローブヘッド部の電極ピンが、バネ性を有する同一
材質でコイルバネ部と該コイルバネ部の両端の電極ピン
先端部の一体化構造であり、かつ該コイルバネ部の長手
方向の中心軸に対して軸対称の構造であり、 該プローブヘッド部の電極ピンのコイルバネ部が、その
両端部又は全体において、外径寸法が長手方向に端部に
向かってテーパ状に減少する構造であることを特徴とす
る半導体素子検査装置。1. A semiconductor device inspecting apparatus having a probe head section for transmitting an electric signal by contacting an electrode pad of a semiconductor wafer, wherein an electrode pin of the probe head section is made of the same material having a spring property, and a coil spring section is provided. The electrode pin tips at both ends of the coil spring portion are integrated with each other and are axially symmetric with respect to the central axis in the longitudinal direction of the coil spring portion, and the coil spring portion of the electrode pin of the probe head portion has both ends thereof. A semiconductor element inspecting device having a structure in which a part or the whole thereof has an outer diameter tapering in the longitudinal direction toward the end.
バネ部が、その両端部において、らせんピッチ長さが長
手方向に端部に向かって順次減少する構造であることを
特徴とする特許請求の範囲第１項記載の半導体素子検査
装置。2. The coil spring portion of the electrode pin of the probe head portion has a structure in which, at both ends thereof, the spiral pitch length is gradually reduced in the longitudinal direction toward the end portion. The semiconductor device inspection apparatus according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62128169A JPH0815171B2 (en) | 1987-05-27 | 1987-05-27 | Semiconductor element inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62128169A JPH0815171B2 (en) | 1987-05-27 | 1987-05-27 | Semiconductor element inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63293845A JPS63293845A (en) | 1988-11-30 |
| JPH0815171B2 true JPH0815171B2 (en) | 1996-02-14 |
Family
ID=14978109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62128169A Expired - Lifetime JPH0815171B2 (en) | 1987-05-27 | 1987-05-27 | Semiconductor element inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0815171B2 (en) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05204765A (en) * | 1992-01-30 | 1993-08-13 | Nec Ic Microcomput Syst Ltd | Microcomputer |
| JP2597826Y2 (en) * | 1992-03-19 | 1999-07-19 | 有限会社ヨシ・コーポレーション | Spring connection terminal |
| JPH05275034A (en) * | 1992-03-27 | 1993-10-22 | Toshiba Corp | X-ray image tube |
| US5414369A (en) * | 1992-11-09 | 1995-05-09 | Nhk Spring Co., Ltd. | Coil spring-pressed needle contact probe modules with offset needles |
| JP3414593B2 (en) * | 1996-06-28 | 2003-06-09 | 日本発条株式会社 | Conductive contact |
| JPH10197558A (en) * | 1997-01-07 | 1998-07-31 | Itabashi Giken Kk | Performance checking mechanism for ic device |
| EP1113275B1 (en) * | 1998-07-10 | 2006-08-30 | Nhk Spring Co.Ltd. | Conductive contact |
| JP4880120B2 (en) * | 1998-07-10 | 2012-02-22 | 日本発條株式会社 | Conductive contact |
| JP2000039447A (en) * | 1998-07-23 | 2000-02-08 | Tokyo Electron Ltd | Probing card |
| JP2000227441A (en) * | 1999-02-05 | 2000-08-15 | Onishi Denshi Kk | Probe unit for inspecting printed circuit board |
| JP3597738B2 (en) * | 1999-03-12 | 2004-12-08 | 日本発条株式会社 | Conductive contact and conductive contact assembly |
| JP2001116768A (en) * | 1999-10-20 | 2001-04-27 | Shin Etsu Polymer Co Ltd | Semiconductor wafer and contact for semiconductor chip |
| JP3691368B2 (en) * | 2000-08-04 | 2005-09-07 | 井上商事株式会社 | Printed circuit board continuity inspection jig |
| US6530511B2 (en) | 2001-02-13 | 2003-03-11 | Medallion Technology, Llc | Wire feed mechanism and method used for fabricating electrical connectors |
| US6528759B2 (en) | 2001-02-13 | 2003-03-04 | Medallion Technology, Llc | Pneumatic inductor and method of electrical connector delivery and organization |
| US6729026B2 (en) | 2001-02-13 | 2004-05-04 | Medallion Technology, Llc | Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors |
| US6584677B2 (en) | 2001-02-13 | 2003-07-01 | Medallion Technology, Llc | High-speed, high-capacity twist pin connector fabricating machine and method |
| US6781390B2 (en) | 2001-07-20 | 2004-08-24 | Nhk Spring Co., Ltd. | Conductive coil contact member |
| US6716038B2 (en) | 2002-07-31 | 2004-04-06 | Medallion Technology, Llc | Z-axis connection of multiple substrates by partial insertion of bulges of a pin |
| WO2006114828A1 (en) * | 2005-04-06 | 2006-11-02 | Advantest Corporation | Socket and electronic component testing apparatus using such socket |
| JP4823667B2 (en) | 2005-12-05 | 2011-11-24 | 日本発條株式会社 | Probe card |
| CN101322035B (en) | 2005-12-05 | 2011-12-21 | 日本发条株式会社 | Probe card |
| JP4842640B2 (en) | 2005-12-28 | 2011-12-21 | 日本発條株式会社 | Probe card and inspection method |
| JP4937882B2 (en) * | 2007-11-01 | 2012-05-23 | 株式会社日本マイクロニクス | Inspection socket |
| US8613622B2 (en) | 2011-02-15 | 2013-12-24 | Medallion Technology, Llc | Interconnection interface using twist pins for testing and docking |
| JP5894718B2 (en) * | 2013-02-25 | 2016-03-30 | 秀雄 西川 | Contact, inspection jig, and method of manufacturing contact |
| JP6180370B2 (en) * | 2014-05-30 | 2017-08-16 | タツタ電線株式会社 | Dielectric strength test of insulated wires |
| JP2020134217A (en) * | 2019-02-15 | 2020-08-31 | 株式会社サンケイエンジニアリング | Spring structure and inspection jig having the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4430779Y1 (en) * | 1967-07-18 | 1969-12-18 | ||
| JPS60207343A (en) * | 1984-03-31 | 1985-10-18 | Yokowo Mfg Co Ltd | Inspecting device for circuit board or the like |
-
1987
- 1987-05-27 JP JP62128169A patent/JPH0815171B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63293845A (en) | 1988-11-30 |
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