JPH10197558A - Performance checking mechanism for ic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve performance checking accuracy by housing contactors having contactor base parts on the central side and contactor lever parts extendedly arranged on its both ends, in a large number of contactor housing chambers formed in a pair of connated casings. SOLUTION: In a pair of casings 1a and 1b, a large number of contactor housing chambers 3a having small through holes 4a are respectively formed in a row in the vertical direction of connated surfaces 2a on both bottom surfaces. Contactors 5 are formed of contactor base parts 5a formed in a coil spring shape on the central side and contactor lever parts 5b which are extendedly arranged on its both ends and are formed in a bar shape and have contact surfaces 5c on the tips. The base parts 5a are respectively housed in the housing chambers 3a, and the lever parts 5b are respectively penetrated through the small holes 4a, and the connated surfaces 2a of the casings 1a and 1b are connated to each other. Then, one side contact surface 5c is brought into contact with an electrode of an IC device, and the other side contact surface 5c is connected to a performance checker, and performance is checked. In this way, the contactors 5 can be simplified and miniaturized, and a performance checking mechanism can cope with a performance check of the miniaturized IC device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a performance checking mechanism for an IC device for checking the performance of an IC device, and more particularly, to an IC device which is simultaneously contacted with a large number of electrodes of an IC device to be minimized. The present invention relates to a performance check mechanism for accurately checking the performance of a device.

[0002]

2. Description of the Related Art Conventionally, such a check mechanism of an IC device has, as shown in FIG. The contact 14 has a cylindrical contact base 14a, and a contact rod 14c having a contact surface 14b formed at the tip end of the contact base 14a. Then, the contact base portion 14a is housed in the contact housing portion 12 and the contact rod portion 14c is made to penetrate through the small through-hole 13 so that the cylindrical contact base portion 14a is formed.
A coil spring 16 is inserted through the inner cylinder of the piston 15 at the tip of a piston-shaped pressing element 15, and the electrode of the IC device is brought into contact with the contact surface of the contact element to check the performance.

[0003]

However, IC devices in recent years have been miniaturized at an accelerating rate, and the performance check mechanism of the IC device described above cannot keep up with the miniaturization of IC devices due to its complicated structure. This has led to a decrease in the accuracy and efficiency of performance checks.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems.
As a result of diligent study, a pair of casings to be joined at the joining surface, a large number of contact storage chambers formed vertically and in a row in the joining surface of the casing, and A through hole, a contact base formed in the shape of a coil spring at the center of the contact, a rod-shaped contact rod extending to both ends of the contact base, and a tip formed at the tip of the contact rod. And a contact surface that is provided.

Accordingly, it is an object of the present invention to provide a miniaturized I
An object of the present invention is to provide and provide a performance check mechanism for an IC device that can correspond to a performance chuck of a C device.

[0006]

According to the present invention, since the contact is formed as a single member consisting of a contact base in the form of a coil spring and a contact rod extending from the contact base, a performance check for an IC device is performed. In addition to minimizing the mechanism, the occurrence of troubles is drastically reduced.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a performance check mechanism for an IC device according to the present invention.

FIG. 1 is an explanatory view of a main part of an embodiment of a performance check mechanism for an IC device according to the present invention, and FIG. 2 is an explanatory view of a conventional performance check mechanism for an IC device.

The present invention relates to a performance checking mechanism for an IC device for checking the performance of an IC device. More specifically, the present invention relates to a mechanism for checking the performance of an IC device by simultaneously contacting a large number of electrodes of an IC device to be minimized. The present invention relates to a performance checking mechanism for accurately checking a pair of casings 1a. 1b and the respective casings 1a. 1b coalescing surface 2a. 2b, a large number of contact storage chambers 3a. 3b
And the plurality of contact storage chambers 3a. 3b, through-holes 4a. 4b, and a contact base 5 formed in a coil spring shape on the central side of each of the plurality of contacts 5
a, and rod-shaped contact rod portions 5b. b extending to both ends of the respective contact base portions 5a. 5b and the respective contact rod portions 5
b. 5b. A contact surface 5c. 5c,
The plurality of contact storage chambers 3a. 3b, each of the contact bases 5
a in each of the through holes 4a. 4b have respective contact rod portions 5b. 5b and the pair of casings 1a. 1b coalescing surface 2a. 2b is coalesced.

That is, the casing 1a. Of the performance check mechanism for IC devices of the present invention. 1b is formed by means such as resin molding and has a box-like appearance, and each of the flat bonding surfaces 2a. It is divided into one casing 1a and the other casing 1b by 2b, and may be formed symmetrically or asymmetrically with the one casing 1a and the other casing 1b.

Then, as shown in FIG. 1, the respective joining surfaces 2 are attached to one casing 1a and the other casing 1b.
a. 2b, a large number of cylindrical contact storage chambers 3a. 3b are formed in a line.

Further, the plurality of contact chambers 3a. 3b
Has a casing 1a. 1b to penetrate through the contact rod 5b. 5b to penetrate through holes 4a. 4b.

Next, the contact 5 is made of a conductive iron group metal wire or the like. Further, a bar-shaped contact rod 5b. 5b are extended, and the contact rod portions 5b. 5b has a contact surface 5c. 5c.

Further, the contact 5 is plated in consideration of electrical conductivity, corrosion resistance and slidability.

The performance check mechanism for an IC device according to the present invention includes the first casing 1a and the second casing 1b joined to each other at the joining surfaces 2a. 2b, and the casing 1a on one side
The contact 5 is sequentially inserted into a large number of contact storage chambers 3a in a row formed in the vertical direction of the joining surface 2a.
One end of the contact base 5a on the insertion side of the contact 5 abuts against the bottom surface of the contact housing 3a of the casing, and the contact rod 5b penetrates through the small through-hole 4a and protrudes outward from the casing 1a. It is.

The joining surface 2 of the other casing 1b
When b is bonded to the bonding surface 2a of the casing 1a on one side, the contact base 5a protruding from the bonding surface 2a of the casing 1a on one side is stored in the contact storage chamber 3b of the casing 1b on the other side. At the same time, the contact rod portions 5b of the respective contacts 5 are inserted into the respective small through holes 4b of the casing 1b on the other side.
The tip side of the contact rod portion 5b projects outward from the casing 1b on the other side.

Next, the contact surface 5c formed at the tip of one contact 5 is brought into contact with the electrode of the IC device, and the contact surface 5c formed at the tip of the other contact 5 is connected to the performance checker. This is to check the performance of the device.

[0018]

According to the present invention, the performance check mechanism for an IC device is provided with a pair of casings which are joined together at the joining surface as described above. A small hole is provided, and the contact is formed as a single member including a coil spring-shaped contact base and a contact rod extending from the contact base, thereby simplifying the contact. It is an invention that is epoch-making and highly practical because it functions properly and the occurrence of troubles is drastically reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a main part of an embodiment of a performance check mechanism for an IC device according to the present invention.

FIG. 2 is an explanatory diagram of a conventional IC device performance check mechanism.

[Explanation of symbols]

 1a Casing 1b Casing 2a Joining surface 2b Joining surface 3a Contact storage chamber 3b Contact storage chamber 4a Small through hole 4b Small through hole 5 Contact 5a Contact base 5b Contact rod 5c Contact surface

Claims (1)

[Claims] 1. A pair of casings joined at a joining surface,
A large number of contact storage chambers formed in a row in a direction perpendicular to the joining surface of the respective casings, a small through-hole penetrating through the bottom surface of each of the multiple contact storage chambers, A contact base formed in a coil spring shape on the center side of each of the contacts, rod-shaped contact rods extending to both ends of the respective contact bases, and a tip formed on each of the contact rods; The contact bases are respectively housed in the large number of contact storage chambers, the respective contact rods are passed through the respective small through holes, and the joint surfaces of the pair of casings are formed. A performance checking mechanism for an IC device, wherein the performance checking mechanism is combined.