JPH0431800B2 - - Google Patents
Info
- Publication number
- JPH0431800B2 JPH0431800B2 JP4214583A JP4214583A JPH0431800B2 JP H0431800 B2 JPH0431800 B2 JP H0431800B2 JP 4214583 A JP4214583 A JP 4214583A JP 4214583 A JP4214583 A JP 4214583A JP H0431800 B2 JPH0431800 B2 JP H0431800B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tin
- melting point
- alloy
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4214583A JPS59169694A (ja) | 1983-03-16 | 1983-03-16 | 半田接着方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4214583A JPS59169694A (ja) | 1983-03-16 | 1983-03-16 | 半田接着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59169694A JPS59169694A (ja) | 1984-09-25 |
| JPH0431800B2 true JPH0431800B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-05-27 |
Family
ID=12627768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4214583A Granted JPS59169694A (ja) | 1983-03-16 | 1983-03-16 | 半田接着方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59169694A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6187396A (ja) * | 1984-10-05 | 1986-05-02 | 株式会社日立製作所 | 電子回路装置とその製造方法 |
| JPS6471591A (en) * | 1987-09-09 | 1989-03-16 | Sumitomo Spec Metals | Joining method for metal or alloy piece |
| JPH04270092A (ja) * | 1991-01-21 | 1992-09-25 | Mitsubishi Electric Corp | 半田材料及び接合方法 |
| JPH0596395A (ja) * | 1991-10-04 | 1993-04-20 | Mitsubishi Electric Corp | 接合材、接合方法および半導体装置 |
| US5881945A (en) * | 1997-04-30 | 1999-03-16 | International Business Machines Corporation | Multi-layer solder seal band for semiconductor substrates and process |
| JPWO2024176947A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2023-02-22 | 2024-08-29 |
-
1983
- 1983-03-16 JP JP4214583A patent/JPS59169694A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59169694A (ja) | 1984-09-25 |