JPH043107B2 - - Google Patents
Info
- Publication number
- JPH043107B2 JPH043107B2 JP57076303A JP7630382A JPH043107B2 JP H043107 B2 JPH043107 B2 JP H043107B2 JP 57076303 A JP57076303 A JP 57076303A JP 7630382 A JP7630382 A JP 7630382A JP H043107 B2 JPH043107 B2 JP H043107B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wafer
- pattern
- name
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P74/00—
-
- H10W46/603—
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57076303A JPS58194348A (ja) | 1982-05-07 | 1982-05-07 | ウエハ内チツプの自動種別確認方式 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57076303A JPS58194348A (ja) | 1982-05-07 | 1982-05-07 | ウエハ内チツプの自動種別確認方式 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58194348A JPS58194348A (ja) | 1983-11-12 |
| JPH043107B2 true JPH043107B2 (enExample) | 1992-01-22 |
Family
ID=13601597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57076303A Granted JPS58194348A (ja) | 1982-05-07 | 1982-05-07 | ウエハ内チツプの自動種別確認方式 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58194348A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715931B2 (ja) * | 1985-08-30 | 1995-02-22 | キヤノン株式会社 | ウェハ処理装置 |
| JPH04130386U (ja) * | 1991-05-23 | 1992-11-30 | 株式会社ダイクレ | Frpグレーチングの積層構造 |
-
1982
- 1982-05-07 JP JP57076303A patent/JPS58194348A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58194348A (ja) | 1983-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW452915B (en) | Method of sorting and investigating automatic semiconductor wafer with extended optical inspection and apparatus for implementing the same | |
| US4985676A (en) | Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns | |
| US5777485A (en) | Probe method and apparatus with improved probe contact | |
| US6097204A (en) | Inspection apparatus with real time display | |
| WO1998001745A9 (en) | Automatic semiconductor wafer sorter/prober with extended optical inspection | |
| TW201906055A (zh) | 基板搬出方法 | |
| JP2939657B2 (ja) | プローブ検査装置 | |
| JPH043107B2 (enExample) | ||
| JPH08327658A (ja) | 基板検査装置 | |
| JPS6351651A (ja) | ウエハプロ−バのウエハ自動位置合わせ方法 | |
| JPS62262438A (ja) | ウエハ処理装置 | |
| JPH0685409B2 (ja) | ウェハ搬送装置 | |
| JPH0715931B2 (ja) | ウェハ処理装置 | |
| JPH0837211A (ja) | 半導体装置の検査装置 | |
| JPS6239822B2 (enExample) | ||
| JP2547406B2 (ja) | 多品種測定装置 | |
| JP2767291B2 (ja) | 検査装置 | |
| JP2885694B2 (ja) | 半導体基板表面の自動外観検査装置 | |
| JP2006319125A (ja) | ウェハ検査方法及びその装置 | |
| JP2939665B2 (ja) | 半導体ウエハの測定方法 | |
| JPH021141A (ja) | プローブ装置 | |
| JP2726899B2 (ja) | プローブ装置 | |
| JPH07105414B2 (ja) | 半導体ウエハのプローブ装置 | |
| JPS6085520A (ja) | パタ−ン検査方法 | |
| JPH04305950A (ja) | 半導体ウエハの測定方法 |