JPH0431034B2 - - Google Patents
Info
- Publication number
- JPH0431034B2 JPH0431034B2 JP1688387A JP1688387A JPH0431034B2 JP H0431034 B2 JPH0431034 B2 JP H0431034B2 JP 1688387 A JP1688387 A JP 1688387A JP 1688387 A JP1688387 A JP 1688387A JP H0431034 B2 JPH0431034 B2 JP H0431034B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ions
- bath
- plating
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 13
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 10
- -1 bromine ions Chemical class 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 3
- 229910052794 bromium Inorganic materials 0.000 claims 3
- 229910052740 iodine Inorganic materials 0.000 claims 3
- 239000011630 iodine Substances 0.000 claims 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 239000006259 organic additive Substances 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1688387A JPS63186893A (ja) | 1987-01-27 | 1987-01-27 | 電磁変換素子及び該素子の導電体作製用銅めっき浴 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1688387A JPS63186893A (ja) | 1987-01-27 | 1987-01-27 | 電磁変換素子及び該素子の導電体作製用銅めっき浴 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63186893A JPS63186893A (ja) | 1988-08-02 |
| JPH0431034B2 true JPH0431034B2 (nl) | 1992-05-25 |
Family
ID=11928570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1688387A Granted JPS63186893A (ja) | 1987-01-27 | 1987-01-27 | 電磁変換素子及び該素子の導電体作製用銅めっき浴 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63186893A (nl) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3498306B2 (ja) * | 1999-09-16 | 2004-02-16 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
| JP5442188B2 (ja) | 2007-08-10 | 2014-03-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 銅めっき液組成物 |
| JP2009041097A (ja) | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
| JP5373970B2 (ja) * | 2010-07-01 | 2013-12-18 | 三井金属鉱業株式会社 | 電解銅箔及びその製造方法 |
-
1987
- 1987-01-27 JP JP1688387A patent/JPS63186893A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63186893A (ja) | 1988-08-02 |
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