JPH0431023B2 - - Google Patents

Info

Publication number
JPH0431023B2
JPH0431023B2 JP30576787A JP30576787A JPH0431023B2 JP H0431023 B2 JPH0431023 B2 JP H0431023B2 JP 30576787 A JP30576787 A JP 30576787A JP 30576787 A JP30576787 A JP 30576787A JP H0431023 B2 JPH0431023 B2 JP H0431023B2
Authority
JP
Japan
Prior art keywords
shower electrode
electrode plate
gas
holes
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP30576787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01149964A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP30576787A priority Critical patent/JPH01149964A/ja
Publication of JPH01149964A publication Critical patent/JPH01149964A/ja
Publication of JPH0431023B2 publication Critical patent/JPH0431023B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
JP30576787A 1987-12-04 1987-12-04 プラズマｃｖｄ装置用シャワー電極 Granted JPH01149964A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30576787A JPH01149964A (ja) 1987-12-04 1987-12-04 プラズマｃｖｄ装置用シャワー電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30576787A JPH01149964A (ja) 1987-12-04 1987-12-04 プラズマｃｖｄ装置用シャワー電極

Publications (2)

Publication Number Publication Date
JPH01149964A JPH01149964A (ja) 1989-06-13
JPH0431023B2 true JPH0431023B2 (enrdf_load_stackoverflow) 1992-05-25

Family

ID=17949102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30576787A Granted JPH01149964A (ja) 1987-12-04 1987-12-04 プラズマｃｖｄ装置用シャワー電極

Country Status (1)

Country Link
JP (1) JPH01149964A (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69024719T2 (de) * 1989-08-14 1996-10-02 Applied Materials Inc Gasverteilungssystem und Verfahren zur Benutzung dieses Systems
JPH03120371A (ja) * 1989-10-01 1991-05-22 Hirano Tecseed Co Ltd 薄膜製造法
GB2241250A (en) * 1990-01-26 1991-08-28 Fuji Electric Co Ltd RF plasma CVD employing an electrode with a shower supply surface
US6379466B1 (en) 1992-01-17 2002-04-30 Applied Materials, Inc. Temperature controlled gas distribution plate
KR100276093B1 (ko) * 1992-10-19 2000-12-15 히가시 데쓰로 플라스마 에칭방법
JP2004190132A (ja) * 2002-11-29 2004-07-08 Kyocera Corp ホットワイヤｃｖｄ装置
JP2005251803A (ja) * 2004-03-01 2005-09-15 Canon Inc プラズマ処理装置およびその設計方法
US8083853B2 (en) 2004-05-12 2011-12-27 Applied Materials, Inc. Plasma uniformity control by gas diffuser hole design
US7785672B2 (en) 2004-04-20 2010-08-31 Applied Materials, Inc. Method of controlling the film properties of PECVD-deposited thin films
CN101871099B (zh) * 2004-07-12 2013-09-25 应用材料公司 通过气体分散器弯曲性的等离子体均匀度控制
KR101110635B1 (ko) * 2005-03-10 2012-02-15 삼성전자주식회사 반도체 제조장치
US20080317973A1 (en) 2007-06-22 2008-12-25 White John M Diffuser support
US8291857B2 (en) 2008-07-03 2012-10-23 Applied Materials, Inc. Apparatuses and methods for atomic layer deposition
US8365591B2 (en) * 2010-11-15 2013-02-05 Rosemount Aerospace Inc. Static port apparatus
JP6485270B2 (ja) * 2015-07-28 2019-03-20 三菱マテリアル株式会社 プラズマ処理装置用電極板

Also Published As

Publication number Publication date
JPH01149964A (ja) 1989-06-13

Similar Documents

Publication Publication Date Title
JPH0431023B2 (enrdf_load_stackoverflow)
US5439524A (en) Plasma processing apparatus
US20210398775A1 (en) Plasma Strip Tool with Multiple Gas Injection
US4820371A (en) Apertured ring for exhausting plasma reactor gases
US4422407A (en) Apparatus for chemically activated deposition in a plasma
JP3266163B2 (ja) プラズマ処理装置
US20060096540A1 (en) Apparatus to manufacture semiconductor
JPH07316824A (ja) 気相反応装置
JPH057861B2 (enrdf_load_stackoverflow)
JPH0338345B2 (enrdf_load_stackoverflow)
JP3682178B2 (ja) プラズマ処理方法及びプラズマ処理装置
US20190376184A1 (en) Chemical vapor deposition shower head for uniform gas distribution
JP2020092027A (ja) プラズマ処理装置、及び、プラズマ処理方法
US5580384A (en) Method and apparatus for chemical coating on opposite surfaces of workpieces
WO2020116248A1 (ja) プラズマ処理装置
JP3229312B2 (ja) 加工物の互いに表裏をなす表面領域に化学的にコーティングを施す方法及びそのための装置
JPH0885876A (ja) 高周波プラズマ化学蒸着装置、及び円形基板上にコーティング層を形成する方法
JPS6316625A (ja) ドライエツチング用電極
JPH0543096Y2 (enrdf_load_stackoverflow)
JPS60123033A (ja) プラズマ処理装置
JPH04154117A (ja) 減圧ｃｖｄ装置
JP2848755B2 (ja) プラズマｃｖｄ装置
JPS6324623A (ja) プラズマ処理装置
JPS6124467B2 (enrdf_load_stackoverflow)
JPH0517698B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 16

Free format text: PAYMENT UNTIL: 20080525