JPH01149964A - プラズマcvd装置用シャワー電極 - Google Patents
プラズマcvd装置用シャワー電極Info
- Publication number
- JPH01149964A JPH01149964A JP30576787A JP30576787A JPH01149964A JP H01149964 A JPH01149964 A JP H01149964A JP 30576787 A JP30576787 A JP 30576787A JP 30576787 A JP30576787 A JP 30576787A JP H01149964 A JPH01149964 A JP H01149964A
- Authority
- JP
- Japan
- Prior art keywords
- shower electrode
- holes
- electrode plate
- gas
- shower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30576787A JPH01149964A (ja) | 1987-12-04 | 1987-12-04 | プラズマcvd装置用シャワー電極 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30576787A JPH01149964A (ja) | 1987-12-04 | 1987-12-04 | プラズマcvd装置用シャワー電極 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01149964A true JPH01149964A (ja) | 1989-06-13 |
JPH0431023B2 JPH0431023B2 (enrdf_load_stackoverflow) | 1992-05-25 |
Family
ID=17949102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30576787A Granted JPH01149964A (ja) | 1987-12-04 | 1987-12-04 | プラズマcvd装置用シャワー電極 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01149964A (enrdf_load_stackoverflow) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03120371A (ja) * | 1989-10-01 | 1991-05-22 | Hirano Tecseed Co Ltd | 薄膜製造法 |
GB2241250A (en) * | 1990-01-26 | 1991-08-28 | Fuji Electric Co Ltd | RF plasma CVD employing an electrode with a shower supply surface |
US5423936A (en) * | 1992-10-19 | 1995-06-13 | Hitachi, Ltd. | Plasma etching system |
US5451290A (en) * | 1989-08-14 | 1995-09-19 | Applied Materials, Inc. | Gas distribution system |
US6379466B1 (en) | 1992-01-17 | 2002-04-30 | Applied Materials, Inc. | Temperature controlled gas distribution plate |
JP2004190132A (ja) * | 2002-11-29 | 2004-07-08 | Kyocera Corp | ホットワイヤcvd装置 |
WO2006017136A3 (en) * | 2004-07-12 | 2006-09-21 | Applied Materials Inc | Plasma uniformity control by gas diffuser curvature |
KR100712172B1 (ko) * | 2004-03-01 | 2007-04-27 | 캐논 가부시끼가이샤 | 플라스마 처리장치 및 그의 설계방법 |
CN100373535C (zh) * | 2005-03-10 | 2008-03-05 | 三星电子株式会社 | 半导体制造装置 |
WO2010003093A3 (en) * | 2008-07-03 | 2010-04-08 | Applied Materials, Inc. | Apparatuses for atomic layer deposition |
US7785672B2 (en) | 2004-04-20 | 2010-08-31 | Applied Materials, Inc. | Method of controlling the film properties of PECVD-deposited thin films |
EP2453244A1 (en) * | 2010-11-15 | 2012-05-16 | Rosemount Aerospace Inc. | Static port apparatus |
US9200368B2 (en) | 2004-05-12 | 2015-12-01 | Applied Materials, Inc. | Plasma uniformity control by gas diffuser hole design |
JP2017028220A (ja) * | 2015-07-28 | 2017-02-02 | 三菱マテリアル株式会社 | プラズマ処理装置用電極板 |
US9580804B2 (en) | 2007-06-22 | 2017-02-28 | Applied Materials, Inc. | Diffuser support |
-
1987
- 1987-12-04 JP JP30576787A patent/JPH01149964A/ja active Granted
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5451290A (en) * | 1989-08-14 | 1995-09-19 | Applied Materials, Inc. | Gas distribution system |
JPH03120371A (ja) * | 1989-10-01 | 1991-05-22 | Hirano Tecseed Co Ltd | 薄膜製造法 |
GB2241250A (en) * | 1990-01-26 | 1991-08-28 | Fuji Electric Co Ltd | RF plasma CVD employing an electrode with a shower supply surface |
US6379466B1 (en) | 1992-01-17 | 2002-04-30 | Applied Materials, Inc. | Temperature controlled gas distribution plate |
US5423936A (en) * | 1992-10-19 | 1995-06-13 | Hitachi, Ltd. | Plasma etching system |
JP2004190132A (ja) * | 2002-11-29 | 2004-07-08 | Kyocera Corp | ホットワイヤcvd装置 |
KR100712172B1 (ko) * | 2004-03-01 | 2007-04-27 | 캐논 가부시끼가이샤 | 플라스마 처리장치 및 그의 설계방법 |
US7785672B2 (en) | 2004-04-20 | 2010-08-31 | Applied Materials, Inc. | Method of controlling the film properties of PECVD-deposited thin films |
US10312058B2 (en) | 2004-05-12 | 2019-06-04 | Applied Materials, Inc. | Plasma uniformity control by gas diffuser hole design |
US9200368B2 (en) | 2004-05-12 | 2015-12-01 | Applied Materials, Inc. | Plasma uniformity control by gas diffuser hole design |
US10262837B2 (en) | 2004-05-12 | 2019-04-16 | Applied Materials, Inc. | Plasma uniformity control by gas diffuser hole design |
WO2006017136A3 (en) * | 2004-07-12 | 2006-09-21 | Applied Materials Inc | Plasma uniformity control by gas diffuser curvature |
CN100373535C (zh) * | 2005-03-10 | 2008-03-05 | 三星电子株式会社 | 半导体制造装置 |
US9580804B2 (en) | 2007-06-22 | 2017-02-28 | Applied Materials, Inc. | Diffuser support |
WO2010003093A3 (en) * | 2008-07-03 | 2010-04-08 | Applied Materials, Inc. | Apparatuses for atomic layer deposition |
US8293015B2 (en) | 2008-07-03 | 2012-10-23 | Applied Materials, Inc. | Apparatuses and methods for atomic layer deposition |
US8291857B2 (en) | 2008-07-03 | 2012-10-23 | Applied Materials, Inc. | Apparatuses and methods for atomic layer deposition |
US8747556B2 (en) | 2008-07-03 | 2014-06-10 | Applied Materials, Inc. | Apparatuses and methods for atomic layer deposition |
US9017776B2 (en) | 2008-07-03 | 2015-04-28 | Applied Materials, Inc. | Apparatuses and methods for atomic layer deposition |
EP2453244A1 (en) * | 2010-11-15 | 2012-05-16 | Rosemount Aerospace Inc. | Static port apparatus |
US8365591B2 (en) | 2010-11-15 | 2013-02-05 | Rosemount Aerospace Inc. | Static port apparatus |
JP2017028220A (ja) * | 2015-07-28 | 2017-02-02 | 三菱マテリアル株式会社 | プラズマ処理装置用電極板 |
Also Published As
Publication number | Publication date |
---|---|
JPH0431023B2 (enrdf_load_stackoverflow) | 1992-05-25 |
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Legal Events
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